Designing PCBs used to be easy. Typically PCBs only had a few components. They usually only had one or two layers. Data rates were a few Kbps or Mbps. Like The Right Stuff, Richard Dean Anderson's MacGyver and Tang, these are concepts only understood by engineers of a certain era. What about today? PCB Designers and Layout Engineers face a growing number of design challenges. Data rates seem to get faster by the day. PCB design teams span the globe. … [Read more...]
Real World 28 Gbps Connector Demonstration
The 28 Gbps Product Demonstrator is an active system that showcases Samtec interconnect products at 28 Gbps and beyond. In this brief video overview, Scott McMorrow, Samtec's CTO of Signal Integrity Products, and Brian Vicich, VP of Engineering, explain that it was designed to showcase Samtec’s products, along with the engineering capabilities of Samtec’s Teraspeed Consulting Group, Active System Group, and the Signal Integrity Group. Real World 28 Gbps The 28 Gbps Product … [Read more...]
Samtec Introduces 14 Gbps FireFly™ FMC Development Kit
System designers and engineers constantly face design challenges to achieve higher data-rates in highly dense applications. A popular system-level design approach in many high-speed applications marries the configurability and high-speed performance of FPGAs with the advantages of fiber optics. Samtec's new 14 Gbps FireFly™ FMC Development Kit provides an easy connection between FPGAs and fiber optics. This new solution offers an easy-to-use evaluation and development … [Read more...]
High Speed, Miniature Edge Card Sockets
Samtec high-speed, edge card interconnect systems are available in a variety of pitches, stack heights, and orientations. They are used just about everywhere, including computers and peripherals, telecom, datacom, industrial equipment, medical, test and measurement, instrumentation, and military and aerospace, among others. Speaking of variety, edge card socket strips are available on 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm, and 2.00 mm pitch. Orientations include vertical … [Read more...]
SEARAY High Speed, High Density Connector
SEARAY™ is a family of high speed, high density connectors. SEARAY gives designers tons of design flexibility, much more than any other array product in the connector industry. Design Flexibility SEARAY is on a 1.27 mm X 1.27 mm grid. This is an open pin field grid array, which means we don’t have pins dedicated as signal or ground. Designers can specify some pins for single-ended signals, some can be routed as differential pairs, some ground, and some for power, all on the same … [Read more...]
GCT For Miniature Substrate Packaging
In this short video, Steve Groothuis, Chief Technology Officer for Samtec Microelectronics, explains Glass Core Technology (GCT), why it matters in advanced substrate packaging, and the solutions it provides. GCT is a proprietary process that leverages the performance benefits of glass by creating small diameter, fine pitch Through-Glass Vias that are metalized and hermetically sealed. The TGVs are linked via a unique thin film Redistribution Layer (RDL) process to create custom … [Read more...]
Samtec Launches New Twinax FlyOver ChalkTalk
What have you done for me lately? No doubt all employees have at least mentally heard those words from their employers. "Here is the latest on the widget project," said everyone to their boss. Designers and engineers especially hear that question. The constant expectation for endless improvement and innovations remains a part of everyday life for engineers. Electrical engineers, signal integrity specialists, and PCB designers face a unique challenge. As bandwidth … [Read more...]
Samtec Releases High-Speed Board-to-Board Application Design Guide
If connector speed is a driver of industry growth, then Samtec is leading the pack. We offer not only the largest variety of high-speed board-to-board connectors, but we combine that with full engineering support, online tools and an unmatched service attitude to provide customers with a complete high-speed solution. To support this product line, a new High-Speed Board-to-Board Application Design Guide has been released. This brochure is a great overview of all that Samtec offers in … [Read more...]
High Speed Mezzanine Connectors With Integral Ground Planes
Samtec Q Strip® connectors are designed for high speed board-to-board applications where signal integrity is essential. The Q Strip connectors have surface mount signal contacts as well as a surface mount ground plane between the two rows of signals for improved electrical performance. Q Strip products are available on three different pitches: 0.50 mm pitch (QTH, QSH Series)0.80 mm pitch (QTE, QSE Series)0.635 mm pitch (QTS, QSS Series) By the way, the 0.50 mm pitch versions are … [Read more...]
Samtec Microelectronics at ECTC 2017
Samtec will be attending ECTC 2017 from May 30 to June 2 at Booth 313/315. We will be featuring several IC packaging solutions such as flip chip, ultra high density micro interposers, as well as offering full system support. In addition, we will also be showcasing our glass core technology (GCT). ECTC The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic … [Read more...]
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