Wait . . . An AI hardware platform without a GPU? Is that even possible?
Obviuolsy, I jest. GPUs are the workhorse solutions for ever larger LLMs and cutting-edge generative AI defining current and future iterations of data center architectures. However, the power of AI is also being brought to the network’s edge using SoMs based on the AMD Versal™ AI Edge series of Adaptive SoCs.
Avnet just released the VE2302 SOM and accompanying AI Edge IO Carrier Card. Together, they make the VE2302 Development Kit. These new solutions offer prototype-to-production capabilities specifically for optical object recognition, LIDAR and RADAR based detection, robotics, AI/ML, industrial control and automation, and embedded compute applications.
Let’s learn a little more about this powerful new suite of tools from Avnet.
VE2302 SoM
The VE2302 SoM provides the flexibility and versatility for developers to enable designs with the AMD Versal AI Edge series. This SoM is based on the Versal AI Edge VE2302 device featuring 328K programmable logic cells with a Dual-core Arm® Cortex®-A72 MPCore™ and Dual-core Arm Cortex-R5F MPCore, as well as L1 and L2 cache and 256KB on-chip memory all with ECC.
Other features include:
- Memory: 4GB LPDDR4, 64MB OSPI Flash, 32GB eMMC.
- I/O: 8x GTYP transceivers, 22x HDIO, 13x PMC MIO, 12x LPD MIO, 104x XPIO, and SYSMON
- Interfaces: GigE, USB2.0, I2C MAC EEPROM, I2C 8-bit IO Expander, PMBus and more
- Expansion Connectors: 3x Samtec AcceleRate® HD High-Density 4-Row connectors
VE2302 Development Kit
The VE2302 Development Kit is specifically designed to evaluate Avnet’s VE2302 SoM and AI Edge IO Carrier Card. With a VE2302 DK a designer can assess the capabilities of the AMD Versal AI Edge Adaptive SoC with a combination of versatile peripherals. This combination helps designers to kick-start product development giving access to the feature set of the Versal AI Edge Adaptive SoC.
The VE2302-DK uses the 104 XPIO, 22 HDIO, 13 PMC MIO, 12 LPD MIO and 8 GTYP transceivers that are available from the VE2302 SOM via three 160-pin Samtec AcceleRate® HD High-Density 4-Row connectors that mount to the AI Edge IO Carrier Card.
Samtec AcceleRate® HD High-Density 4-Row Connectors
Samtec’s AcceleRate® HD ultra-dense, open-pin-field arrays are rated for 64 Gbps PAM4 (32 Gbps NRZ) on a 0.635 mm pitch. AcceleRate® HD features high-speed Edge Rate® contacts designed for high-speed, high-cycle applications.
The surface of the contact is milled creating a smooth mating surface, which reduces wear on the contact increasing durability and cycle life. Also, lower insertion and withdrawal forces allow zippered unmating.
Key features of the interconnct include:
- Incredibly dense with up to 400 total I/Os
- Low profile 5 mm and up to 16 mm stack heights
- Slim 5 mm width
- 4-row design; 10 – 100 positions per row
- Edge Rate® contact system optimized for signal integrity performance
- Open-pin-field design for grounding and routing flexibility
- Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
- PCIe® 6.0 capable
- Right-angle and cable in development
- SureWare™ ultra rugged guide post standoffs available (GPSO)
- View the full line of AcceleRate® products
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