A joint demonstration between Samtec and eSilicon — an eSilicon 7 nm 56 Gbps DSP SerDes over a Samtec 5 meter ExaMAX® backplane cable assembly — caught a lot of attention at SC18. The demo showed a true long-reach capability with a high-performance, flexible, easy-to-configure SerDes that targets common data center standards and data rates. […]
Characterization and Development Kits Viewable Across Samtec.com
Over the past few years, Samtec has expanded its portfolio of Characterization and Development Kits. Engineers and designers demand the best tools for system prototyping. From concept and prototype to development and production, Samtec-designed Characterization and Development Kits featuring high-speed interconnect solutions to help simplify design. Helpfully, they reduce time to market for hobbyists, tinkerers, […]
Increasing Broadband Interconnect Characterization
Samtec’s Gustavo Blando recently presented “Increasing Broadband Interconnect Characterization” at EDI CON 2018 in Santa Clara, California. A video of the workshop is above, and below is Gus’s summary of his presentation. VNA measurements are the backbone of any SI analysis, both for correlation and basic interconnect understanding. As bit rate increases and specs tighten, […]
High Speed Interconnect Demos At Electronica 2018
Samtec’s full line of high speed interconnect products was on display and in demonstrations at Electronica 2018. Focus products included high speed mezzanine high speed cable assemblies high speed backplane connectors active optical cable assemblies Two of the demos that caught a lot of attention were the 28 G Product Demonstrator and the REFLEX CES Sargon […]
Samtec Demos High-Performance Platforms at XDF Silicon Valley
Samtec recently sponsored and attended the Xilinx Developer Forum (XDF) in Silicon Valley. XDF connects software developers and system designers to the deep expertise of Xilinx engineers, partners, and industry leaders. During the event, Samtec showed two high-speed demonstrations. Both platforms marry Samtec interconnect solutions with Xilinx silicon. The XDF demos are featured in the following […]
Reach Beyond the Rack – Samtec/eSilicon 56G 5m Backplane Cable Demo to Debut at SC18
As data centers get faster and more complex, component suppliers must help system architects reach beyond the rack. The first-to-market solution from eSilicon and Samtec demonstrates high-performance connections between backplanes instead of the front panel. All are invited to see the demonstration in Samtec booth #521 at SC18. eSilicon 56G long-reach 7nm DSP SerDes Reach beyond […]
Samtec Introduces New SI Characterization Kits
Any engineer who has designed an IC-based solution likely used some sort of HW development tool. Semiconductor manufacturers have a long history of providing engineers with the HW tools needed to test their silicon. Evaluation platforms, like the Xilinx® Zynq UltraScale+ RFSoC ZCU111 Evaluation Kit, provide the ideal development environment for evaluating the cutting edge silicon. The ZCU111 […]
EDI CON 2018: New Products, New Technologies
EDI CON USA brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, product demonstrations, training, and learning opportunities. And as you have probably already guessed, Samtec will be attending EDI CON. We will be presenting two workshops (more on this below), displaying and demonstrating our RF interconnect solutions, including our […]
Samtec Releases New PC/104 Standards Web Pages
While Samtec continues to push the boundaries of high-speed data rates with evolving silicon-to-silicon, optics, and microelectronics technologies, one of our all-time bestsellers continues to be our Standard Board-to-Board connector series. Samtec’s B2B connectors are what started it all, and, interestingly enough, are what got the company involved with the PC/104 Consortium. For those of […]
Packaging Innovations For Medical Wearables
Steve Groothuis — or Groot to everybody else on this planet — Chief Technology Officer of Samtec Microelectronics, recently presented “Packaging Innovations For Medical Wearables” at the Medical Wearables Conference in Santa Clara, California. Groot’s presentation focused on the specific needs, challenges, and innovations within upcoming medical applications and medical device packaging. We caught up […]
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