Design and Processing Engineers frequently contact our Interconnect Processing Group (IPG) to discuss multiple connector alignment issues on mating PCBs. Our standard response is “it’s easy, don’t worry about the alignment, and we recommend you use as many mated connector sets as possible.” OK, I’m lying. The first part – that IPG receives a lot […]
Samtec to Present at Mentor User2User 2017 PADS Events
Designing PCBs used to be easy. Typically PCBs only had a few components. They usually only had one or two layers. Data rates were a few Kbps or Mbps. Like The Right Stuff, Richard Dean Anderson’s MacGyver and Tang, these are concepts only understood by engineers of a certain era. What about today? PCB Designers […]
Real World 28 Gbps Connector Demonstration
The 28 Gbps Product Demonstrator is an active system that showcases Samtec interconnect products at 28 Gbps and beyond. In this brief video overview, Scott McMorrow, Samtec’s CTO of Signal Integrity Products, and Brian Vicich, VP of Engineering, explain that it was designed to showcase Samtec’s products, along with the engineering capabilities of Samtec’s Teraspeed […]
Samtec to Attend STMicroelectronics Developers Conference 2017
Samtec proudly announces its participation this the ST Developers Conference 2017. This FREE one-day interactive summit will bring together experts in markets that are poised for rapid growth in the coming years: Smart Things for the IoT, Smart Driving, and Smart Home, City & Industry. Meet and learn from industry influencers presenting on a variety […]
Making High Speed PCB Design Easier
High-speed PCB design for applications supporting data rates of 28 Gbps and beyond provides many challenges. PCB designers and layout engineers need to answer many questions: What PCB laminate offers the best performance? What connectors will be used? What is the stack up? How many layers? What about back drilling vias? There are a plethora […]
GCT For Miniature Substrate Packaging
In this short video, Steve Groothuis, Chief Technology Officer for Samtec Microelectronics, explains Glass Core Technology (GCT), why it matters in advanced substrate packaging, and the solutions it provides. GCT is a proprietary process that leverages the performance benefits of glass by creating small diameter, fine pitch Through-Glass Vias that are metalized and hermetically sealed. […]
Samtec Launches New Twinax FlyOver ChalkTalk
What have you done for me lately? No doubt all employees have at least mentally heard those words from their employers. “Here is the latest on the widget project,” said everyone to their boss. Designers and engineers especially hear that question. The constant expectation for endless improvement and innovations remains a part of everyday life for […]
Samtec to Attend STMicroelectronics’ Events
Data connectivity. Everybody wants it. Everybody asks for it. Samtec’s innovative approach to product and solution development led to an investment in nMode Solutions and Triton Microtechnologies in 2016. This strategic acquisition expanded Samtec’s core capabilities and diversified our product offerings for data connectivity and IoT applications. Samtec will provide details into our product roadmap of wireless […]
More Than Just Connectors: Samtec’s Technical Library
Between overdue books, too many “Quiet Please” signs to count, and trying to navigate the Dewey Decimal System, going to the library is never much fun. The same feeling is often true when searching for technical documentation before, during, or after the design process. Scouring page after page can prove frustrating, and answers are hard […]
Microelectronics In Biomedical
Steve “Groot” Groothuis, CTO of Samtec Microelectronics, recently presented “Biomedical Solutions: Successfully Integrating New Chips, Packages, and Modules” at BIOMEDevice in Boston. The presentation included an overview of: How Samtec microelectronics are incorporated into medical devices and diagnostic equipment Glass Core Technology (GCT), a proprietary process that leverages the performance benefits of glass by creating small […]
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