Designing and optimizing a breakout region (or component launch) for a connector can be challenging. It often requires multiple back and forth iterations and analysis to adjust variables. Samtec’s new SIBORGTM (Signal Integrity Breakout Region Guru) is a free tool that works with Ansys HFSS 3D Layout to generate, visualize, optimize, and develop PCB package and component breakout regions (BORs), enabling Samtec customers to design component launches faster. SIBORG was initially intended to be … [Read more...]
Six Samtec Authors Win DesignCon Best Paper Awards
DesignCon 2024 has just announced its Best Paper Awards winners, and six Samtec authors are honored alongside their colleagues from other organizations. Somewhat unique in the world of “conference paper presentations,” DesignCon papers tend to average about 30+ pages with extensive data and research. They frequently include authors across multiple companies and/or universities, which can lead to compelling content and fascinating connections between disciplines. DesignCon Best Paper … [Read more...]
Improving Simulation for High-Speed Designs
At DesignCon 2024, attendees will be treated to a panel that explores the issues associated with designing, modeling, simulating, and measuring electronic systems operating at state-of-the-art speeds. The industry experts will also discuss the design and measurement methodologies needed that ensure simulations are accurate predictions of actual system behavior. On Tuesday 30 January, Todd Westerhoff (Siemens EDA), Al Neves (Wild River Technology), Cathy Liu (Broadcom, Inc), Gary Lytle … [Read more...]
Connectors Address Challenges of 224 Gbps PAM4 Design
Delivering 224 Gbps PAM4 signals will require careful analysis of signal integrity and thermal effects, as well as the development of enabling technologies and new methodologies to achieve clean signals at these data rates. Industry-leading experts are focused on this topic, developing new technologies as well as products to handle high-speed data, and engaging in interoperability demonstrations at tradeshows, demonstrations of new products for 224 Gbps PAM4 systems, and numerous ongoing … [Read more...]
Samtec Supports 224 Gbps at DesignCon 2024
Are you headed to DesignCon 2024? If yes, be sure to stop by the Samtec Booth (#939) to see demonstrations of products that address interconnect needs all the way up to 224 Gbps. New and established Samtec products on display will include those used in front-panel, mid-board, and backplane applications, including our new backplane solutions, optical mid-board options, and test point system. Look for our green shirts at the Welcome Reception on Tuesday and say hello! Try to make some time to … [Read more...]
Samtec Experts on Stage at DesignCon 2024
DesignCon 2024 promises to be another great gathering of the high-speed technical community, where issues of signal integrity, power integrity, EMC/EMI converge. 224 Gbps systems, signals, simulation, and testing are expected to be hot topics in ’24. Samtec will be front and center at DesignCon, as hosts of the Tuesday night Welcome Reception as well as showing our latest products and demos in booth 939 on the show floor (more to come on that in a later blog). There will be a lot going on, … [Read more...]
Sample-Size Lot Screen Testing Saves Time and Money
Many military and/or aerospace designs require production lot testing of components in order to determine if the parts are quality compliant. These full-lot tests can be time consuming and expensive. For some applications, it is possible to instead perform a sample-size lot test, which tests a percentage of the components, to confirm the performance of parts before lot acceptance. At Samtec, we now offer this sample-size lot screening, and it is primarily being used by our military and … [Read more...]
How to Carry Analog, Digital, and Power in One Connector
In a recently published white paper, “Array Connectors for Mixed Signal Multi-Channel RFSoCs up to 8 GHz,” Samtec engineers describe the research, development, simulation, and measurements performed in a project to design the optimal breakout region (BOR) for the use of array connectors that simultaneously carry analog, digital, and power signals in an RF environment, as a replacement for traditional compression mount and threaded PCB connectors. The results show that it is possible to route … [Read more...]
Designing the Oxide Rack
“Teamwork makes the dream work,” may be cliché, but in the case of the technology partnership that developed between Oxide Computer and Samtec, it applies. In an Oxide and Friends podcast , Bryan Cantrill, Co-founder and CTO of Oxide Computer Company, sums the experience up this way: “a perfect partnership, a model partnership—innovating together.” This is the story of designing the Oxide Rack. But what does it mean to be a great partner in tech, and how did Samtec and Oxide Computer create … [Read more...]
Technical Resources Help with Interconnect Design
Specifying interconnects is not always easy. With that in mind, the engineers at Samtec continue to create a wealth of technical information in the form of white papers, case studies, application notes, technical notes, published papers in journals and conference proceedings, webinars, and data sheets. These technical resources help with interconnect design. All of these have been compiled in an updated Technical Library on Samtec.com. You can freely browse, download, and watch these … [Read more...]