DesignCon 2024 promises to be another great gathering of the high-speed technical community, where issues of signal integrity, power integrity, EMC/EMI converge. 224 Gbps systems, signals, simulation, and testing are expected to be hot topics in ’24.
Samtec will be front and center at DesignCon, as hosts of the Tuesday night Welcome Reception as well as showing our latest products and demos in booth 939 on the show floor (more to come on that in a later blog). There will be a lot going on, and we will be focusing on meeting the design challenges in this new era of high-speed connectivity. In addition to answering questions in the booth, Samtec engineers are participating in and/or authoring papers for multiple sessions, including two panels, a tutorial, and six technical sessions.
Scott McMorrow Nominated for Engineer of Year
We are also celebrating the nomination of our colleague Scott McMorrow for the prestigious DesignCon Engineer of the Year Award. DesignCon reports that one of his nominators said this about him: “Scott has been at the absolute forefront of PCBA signal integrity and power integrity engineering, likely for more than 30 years. He is widely recognized as perhaps the preeminent authority for technical exchanges on the SI-LIST. He is truly an industry thought leader within the EE community.”
I met Scott about 10 years ago, and I have long been impressed by his kindness as well as his commitment to explain concepts in his educational endeavors. This year, DesignCon attendees can benefit from Scott’s knowledge in a tutorial and panel on Tuesday 30 January. We wish Scott and his fellow nominees all the best, happily cheer on his accomplishments so far, and look forward to what’s next!
Here’s a summary of where conference attendees can find Scott and many other signal integrity experts from Samtec this year at DesignCon:
Samtec Experts on Stage at DesignCon
Tuesday
Tutorial: How to Develop Advanced PCB Component Launches, Scott McMorrow. Tuesday, 30 January, 9AM, Ballroom B.
Panel: Extreme Confidence Simulation for 400-800G Signal Integrity Design. Scott McMorrow, panelist. Tuesday, 30 January, 4:45-6PM, Ballroom B.
Wednesday
Paper: Comparing the Different Metrics of Intra-Pair Skew in Tracking Channel Performance, Richard Mellitz, Adam Gregory, Steve Krooswyk et al. Wednesday, 31 January, 11:15AM, Ballroom E.
Paper: Realistic Use Cases for Edge, Angled, and Vertical Launch Connectors up to 100 GHz, Sandeep Sankararaman, Gustavo Blando, Istvan Novak, Shawn Tucker. Wednesday, 31 January, 12:15PM Ballroom F.
Paper: 200 Gbps Signaling Per Electric Lane Over 1 Meter of Passive Twinaxial Copper Cable, Richard Mellitz et al. Wednesday, 31 January, 12:15PM, Ballroom C.
Panel: PCI Express: Pathway to 128 GT/s and Interoperability at 64 GT/s (PAM4), Steve Krooswyk et al., Wednesday 31 January, 4:00PM, Ballroom C.
Thursday
Paper: Impact of Finite Interconnect Impedance Including Spatial and Domain Comparison of PDN Characterization, Istvan Novak, Gustavo Blando, et al. Thursday 1 February, 9:00AM, Ballroom E.
Paper: Are 1.0mm Precision RF Connectors Really Required for 224 Gbps PAM4 Verification? Brandon Gore, Richard Mellitz, Andrew Josephson, et al. Thursday 1 February, 11:15AM, Ballroom F.
Paper: Survey on Correlation and Simulation Methodologies for PCB Structures through 67 GHz, Robert Branson, Greylan Smoak, Steve Krooswyk, Scott McMorrow. Thursday 1 February, 2:00PM, Ballroom C.
These technical sessions require a conference pass, you can use code SPECIAL24 to get a 15% discount off of your pass.
Get a Preview
The above speakers will be previewing their talks at the January gEEk spEEk on 18 January at 2:15PM EST. You can register here: Samtec gEEk® spEEk Webinar Series.
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