Nvidia had its annual GTC gathering of AI developers, fans, media, and gamers recently. The newly announced Nvidia Blackwell platform is scheduled for release in late 2024/early 2025. Blackwell will likely lead to another round of “world domination” – I say that tongue in cheek – for the Nvidia.
One thing that struck me is the raw performance the Nvidia GPUs support. Imagine the engineering that goes into develeoping signal channels for the HBM, NVLink, PCIe, CXL, and numerous other high-speed busses. That is a lot of signal integrity.
So does optimized SI lead to optimized AI? Or vice versa? I dunno. In any case, Samtec technical leaders will cover these and related topics in two upcoming webinars:
Signal Integrity for Embedded Computing Applications
Embedded computing developers face new design challenges implementing high-speed protocols like 100 GbE, USB4, PCIe 5.0, DDR4/5, and more. This webinar introduces fundamental signal integrity concepts like insertion loss, return loss, and crosstalk, and relates them to a case study of the connector design for the COM-HPC Module Base Specification Revision 1.2 featuring the new COM-HPC Mini form factor.
When selecting high-speed connectors, several critical parameters need consideration. These include material properties such as dielectric constant and insertion loss, as well as ensuring impedance control and addressing SI concerns like crosstalk. Additionally, exploring advanced connector technologies offers advantages, particularly in high-speed differential signaling. Understanding the design principles and considerations behind these connectors is crucial. Finally, implementing layout guidelines tailored to optimize connector performance and maintain SI further enhances the effectiveness of the chosen connectors in high-speed PCB designs.
Date and time: Wednesday April 24th, 2024 at 1:00 PM ET/10:00 AM PT
AI in the Data Center
High-performance computing (HPC) is a standard in data centers, and that’s the place where many AI functions are performed. Larger AI data models are driving new system architectures that demand increased speeds, bandwidths, frequencies, and densities, as well as scalability and configurability. In this session, we will look at how data-center design differs from conventional embedded computers, and what choices a developer needs to make.
Samtec offers a range of connector and cable options ideal for supporting next-generation AI/ML applications such as accelerators for vision systems and array servers; SoMs/CoMs; computing platform chipsets; and ultra-low latency products. For the designer, Samtec offers full-system optimization support with industry-leading signal-integrity design expertise; characterization and development boards; and online design and development tools.
Date and time: Thursday, April 25th, 2024 at 2:00 PM ET/11:00 AM PT
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