Wait . . . An AI hardware platform without a GPU? Is that even possible? Obviuolsy, I jest. GPUs are the workhorse solutions for ever larger LLMs and cutting-edge generative AI defining current and future iterations of data center architectures. However, the power of AI is also being brought to the network's edge using SoMs based on the AMD Versal™ AI Edge series of Adaptive SoCs. Avnet just released the VE2302 SOM and accompanying AI Edge IO Carrier Card. Together, they make the VE2302 … [Read more...]
From AI to SI: Samtec Participates on Two Upcoming Webinars
Nvidia had its annual GTC gathering of AI developers, fans, media, and gamers recently. The newly announced Nvidia Blackwell platform is scheduled for release in late 2024/early 2025. Blackwell will likely lead to another round of "world domination" - I say that tongue in cheek - for the Nvidia. One thing that struck me is the raw performance the Nvidia GPUs support. Imagine the engineering that goes into develeoping signal channels for the HBM, NVLink, PCIe, CXL, and numerous other … [Read more...]
Guten Tag! Visit Samtec at embedded world 2024 in Nuremberg
It's that time of year again. The world of CoMs, SoMs, interconnect and more all converge next week. The world of embedded systems is multifaceted – from hardware and software to services and tools. The embedded world Exhibition & Conference brings the entire embedded community together once a year in Nuremberg and provides a unique overview of the state-of-the-art in this versatile industry. So what's on the docket for Samtec? Visit Samtec Stand #4A-324 at embedded … [Read more...]
AMD XRF4 RF Accessory Kit Features Samtec Analog Over Array™ Technology
Samtec open-pin-field arrays like SEARAY™ provide designers the ability to simultaneously run differential pairs, single-ended signals, and power through the same board-to-board interconnect. This design approach allows maximum pin-selection, routing, and grounding flexibility. Additionally, Samtec open-pin-field solutions can be used to route differential or single-ended analog or RF signaling in addition to digital differential pairs, single-ended signals, and power in the same connector. … [Read more...]
Samtec Exhibits at OFC 2024 in San Diego
Samtec will be demonstrating next-gen, high-performance optical and copper interconnect solutions at the upcoming OFC 2024 Exhibition at the San Diego Convention Center, San Diego, CA March 26-28, 2024. OFC will also host the OIF Interoperability Demo. Samtec is one of 47 member company participants in the OIF booth, which will spotlight groundbreaking interoperable solutions in 800ZR, 400ZR and OpenZR+ optics; Energy Efficient Interfaces (EEI) & Co-Packaging; 112G and 224G Common … [Read more...]
15 or 60? – Leap Years Explained
A friend of mine told me his birthday was coming up. He told me it was his 15th. "What?" I thought. He's older than me. He then told me his birthday was on February 29. Duh! Now that makes sense. Leap Years! I know we have "leap years," but I could not actually remember why. Maybe I am 60, but not quite yet. Anyway, I cranked up the "Google Machine" to see what I could find. As with any Google search, you can quickly go down a rabbit hole. I guess I should have asked ChatGPT to write this … [Read more...]
Samtec and Rohde & Schwarz Discuss Testing PCIe 5.0/6.0 Cable Implementations
DesignCon 2024 recently highighted the ongoing trend for sending high-speed data over twinax cable assmblies. As AI/ML, HPC, data center and computing system architectures evolve, twinax cable assmeblies can be found in ASIC adjacent or near chip applications as well as solutions routing front-panel to front-panel. PCI Express® technology also is playing a key role in GPU-to-GPU communications as AI clusters become larger and disaggregated. Connecting GPU-based AI systems does and will … [Read more...]
Samtec Sponsors Embedded Tech Trends
Embedded computing differs from general computing in one key way. Embedded computing solutions are typically tasked with a specific or dedicated function. An example may be monitoring environmental variables like humidity, temperature, barometric pressure and more in a factory. Embedded computing platforms like SoMs and CoMs constantly add functionality and capability. As a result, the difference between embedded and general computing may be blurred. It's a constant challenge to keep up with … [Read more...]
New Intel/Arrow AXE5-Eagle FPGA Dev Kit with Samtec Interconnects Ready to Ship
FPGAs are taking over the world, or it just seems that way. At least for readers of the Samtec blog. Samtec oftens gets questions as to whether we sell FPGAs or not. Of course we don't, but we do sell VITA 57.1 FMC and VITA 57.4 FMC+ interconnects found on just about every FPGA dev kit in the world. Samtec even offers a wide portfolio of FMC, FMC+ and optical module evaluation kits for real-time development and testing in a lab setting. So, the reader may ask, why does the Samtec blog … [Read more...]
COM-HPC 1.2 Specification Defines New COM-HPC Mini Form Factor
"I shall call him . . . Mini-Me." Fans of 1990s pop culture know that line forever changed the Austin Powers movie trilogy. All the same traits and qualities of the origial in one-eighth the size. Decades later, "Mini-Me" is still a part of the English lexicon. 1990s movie trilogies do not typically influence the technical development of industry standards. Yet, the latest PICMG COM-HPC 1.2 specification certainly tries. ;) A new, small form factor - COM-HPC Mini - targeted at high-growth … [Read more...]
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