Nokia Bell Labs (NBL) is leveraging Samtec glass core technology (GCT) as a platform for custom-designed silicon devices. NBL developed an electronics assembly on a glass package with multiple interconnect and chips to realize a full E-band radio on glass (RoG). To increase the reach of their E-band radio, they partnered with Northrop Grumman (NG),…
The Science of Optical Interconnects, Part 2 In the first article of this series, we explored why optical interconnects are attracting renewed attention throughout the electronics industry. Bandwidth requirements continue to grow, and system architects are searching for solutions to challenges involving power consumption, density, and scalability. How does optical fiber actually work? For many…
Glass Core Technology (GCT) was a hot topic at IMS 2026. One reason is that Samtec GCT has evolved into heterogeneous platforms, as detailed in the brief video from our friend Shahriar Shahramian. Glass is quickly becoming recognized as a viable and vital solution in the evolution of high-performance, high-frequency connectivity due to its material…
The Science of Optical Interconnects, Part 1 The history of electronics is full of predictions that turned out to be wrong. One of my favorites dates back to the early days of structured networking. Around thirty years ago, I attended a training course on premises wiring. At the time, 100 Mbps Ethernet was considered cutting-edge…
Glass Core Technology (GCT) is Samtec’s ability to design and manufacture quick‑turn, extremely small, advanced glass interconnects that support millimeter wave frequencies through D‑band (170 GHz) and higher. To achieve this we leverage state-of-the-art, 100% in-house, semiconductor-style processing techniques including patterning circuits onto glass and formation of our patented through-glass vias (TGVs). This allows us…
In the past few weeks, I have found myself attending several FPGA-themed technical events. Adam Taylor brought his fast-growing FPGA Horizons event to New England. AMD is in the middle of its Embedded Computing Summit series. FPGAs are everywhere, or so it just seems. FPGA-based designs offer many advantages. They offload computing requirements from CPUs,…
Anritsu and Samtec teamed up at DesignCon 2026 and demonstrated how Anritsu’s scalable, production-ready signal integrity test equipment can characterize large numbers of Samtec high-speed interconnect paths. In this brief video, Krishna Krishore (Anritsu) and Matt Burns (Samtec) review the products and processes in the live demonstration. Anritsu Scalable Signal Solution The demo showcased Anritsu’s…
At DesignCon 26, Samtec presented live demonstrations of new products and technologies. Two that received considerable attention were a 448 Gbps Co-Packaged Copper Channel and a 130 GHz Test Platform (224/448 Gbps-capable). In the video above, Samtec’s Andrew Josephson gives a brief overview of the 130 GHz solution. We see two versions of the new…
I like fast cars. Each new car I buy seems to have more horsepower. More speed isn’t needed when driving to the grocery store, but it’s nice to have when passing the overburdened minivan in front of you. In a similar vein, the updated COM-HPC 1.3 specification from PICMG offers a pathway to increased throughput…
Designing and evaluating interconnects requires broadband material characterization to determine dielectric properties. Traditional techniques used to characterize the complex permittivity and permeability of dielectrics, such as NRW and NIST, have some important limitations, such as the occurrence of air gaps and resonances in the results, which become even more challenging for broadband applications. In work…
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