As consumers, no one ever complains that their wireless connectivity is “too fast”. Global wireless carriers and network providers continue to push the limits of 4G LTE, but a next-generation wireless standard – 5G New Radio (5G NR) – is on the horizon. 5G technology will be 100x faster than current 4G LTE solutions currently on […]
New Optical Data Interface Adopts Samtec FireFly™ As Physical Layer
Emerging applications in 5G communications, mil/aero systems, high-speed data acquisition, phased-array radar and communication research will support faster data rates than current generation solutions. Developing and testing these high-performance applications requires advanced instrumentation and embedded systems. Current generation instruments, processors, storage, and embedded devices communicate over copper interfaces in standard form factors and traditional bench instrument […]
NVIDIA Jetson Platforms Connect via Samtec SEARAY™ Open Pin Field Arrays
The growth of system-on-modules (SOMs) in embedded computing presents a paradigm shift in embedded design. Legacy electronics systems typically leveraged discrete chip-down designs. The circuit designer was responsible for the selecting, designing and routing of the CPU, Memory, I/O, power and analog circuitry within their application. EEs continuously met the technical challenges presented before them. […]
Samtec Expands ExaMAX® High-Speed Backplane Connector System With New DMO Options
Networking switches and hubs in next-generation hyperscale data centers must support increased port density and higher data rates. In combination with increased processing power, system designers are leveraging the inherent advantages of direct mate orthogonal architectures when compared with traditional backplane systems. Samtec supports orthogonal backplane architectures with new DMO options from within the ExaMAX® High-Speed […]
Xilinx Features FireFly on VCU118 FPGA Dev Kit
You can do a lot in three minutes. From counting to 180 to making toast, the possibilities are endless. However, our good friend Steve Leibson at Xilinx, encourages you to use your three minutes to take a look at our new video featuring Samtec’s FQSFP cable on Xilinx VCU118 FPGA. We couldn’t agree more. 28Gbps FireFly […]
QSFP-DD MSA Releases Latest Hardware Specification
The battle for next-generation optical transceivers remains active. The three leading specifications duking it out include COBO, OSFP and QSFP-DD. While all have their pros and cons, the industry continues to sort out the best solutions for the front panel and mid-board optical engines. What is QSFP-DD? Current QSFP solutions meet the existing demands of […]
A Vehicle For Insitu Glass Fabric Characterization (EDI CON 2017) – Glass Weave Skew
Glass Weave Skew. For most people it probably sounds like a progressive rock band. But we’re talking about Glass Weave Skew and differential signals. Brandon Gore, Senior Staff Signal Integrity Engineer, and the Manager of Samtec’s Signal Integrity Group, R&D Hub recently presented “A Vehicle For Insitu Glass Fabric Characterization” at EDI CON USA 2017. The […]
Samtec Releases New Product Overview Guide
Who doesn’t like something new? Maybe it’s that new smell, a new flavor, or a new feature that draws you in each and every time. Well, we love new things around here and are excited to share the new Product Overview Guide. It might not smell or taste new, but it is packed with new […]
Microelectronics Group Provides Support For Advanced Microelectronics Applications
The Samtec Microelectronics Group’s (SME) advanced packaging and high-speed interconnect expertise enable us to provide support for the performance, integration and miniaturization demands of next gen applications, including Connectivity, MedTech, MEMS & Sensors, and Optics, Imaging & Photonics. Our advanced package design and glass core technology capabilities, along with standard design guidelines, are detailed in […]
Samtec Enhances Direct Connect™ Cable Systems With New DCH Series
Samtec recently expanded its Direct Connect™ Cable (DCC) Systems with the release of the new Direct Connect™ Horizontal (DCH) High-Speed Press-Fit Twinax Cable Assembly. This new solution targets cost-effective, high-performance flyover or co-planar, right angle and parallel board-to-board applications. Simplifies Assembly, Ideal for High Density Samtec DCH series features a high-retention, press-fit termination offering a […]
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