One Up Studio is a hardware design engineering provider with a focus on signal integrity, and not coincidentally, a Samtec customer. I caught up with Paul Monar, the owner, to pick his brain about some interesting design challenges he faces at One Up and his connector system selection criteria. DANNY: What type of customers use […]
New COTS Embedded Computing Platforms Incorporate FireFly™ for Density and Performance
Small footprints. Less weight. Signal integrity over longer distances. Scalability. Upgradeability. These and other factors are driving the adoption of optical engines in embedded computing. Annapolis Micro Systems, a leading FPGA board and systems supplier, and Samtec have collaborated to integrate the Samtec FireFly™ Optical System in multiple COTS embedded computing platforms. FireFly enables maximum signal density […]
New Avnet UltraZed-EV SoM Features Samtec SEARAY™ 0.80 mm High-Density Arrays
Samtec distributor partner Avnet recently released its new UltraZed-EV Starter Kit targeted at embedded vision applications. Comprised of the UltraZed-EV SoM and the UltraZed-EV Carrier Card, this kit offers engineers and designers a complete platform for prototyping and evaluating embedded video processing systems. The Avnet development team worked with Samtec to identify SEARAY™ 0.80 mm Pitch […]
Packaging Innovations For Medical Wearables
Steve Groothuis — or Groot to everybody else on this planet — Chief Technology Officer of Samtec Microelectronics, recently presented “Packaging Innovations For Medical Wearables” at the Medical Wearables Conference in Santa Clara, California. Groot’s presentation focused on the specific needs, challenges, and innovations within upcoming medical applications and medical device packaging. We caught up […]
Samtec Updates Homepage With Silicon-to-Silicon Focus
As the industry evolves, data rate requirements continue to increase at a rapid pace, approaching and even surpassing 56 Gbps. As this continues, developers are challenged with balancing increasing throughput, scalability and density demands with concerns such as power consumption, signal integrity, cost and time-to-market. Samtec helps address these challenges with industry-leading expertise in high-performance […]
Samtec Announces New VITA 57.4 FMC+ Development Kits with FireFly™ Optical Engines
System designers and engineers constantly face design challenges to achieve higher data-rates in dense, optical applications. A popular system-level design approach in many high-speed applications marries the configurability and high-speed performance of FPGAs with the advantages of fiber optics. Samtec’s new 25 Gbps and 28 Gbps FireFly™ VITA 57.4 FMC+ Development Kits provide an easy connection […]
Samtec Introduces New Flyover™ QSFP28 Cable System
As bandwidth requirements become more difficult to route over any distance through a lossy PCB, system architects now have an alternative signal path strategy through Samtec Flyover™. Samtec Flyover™ designs break the constraints of traditional signaling substrate and hardware offerings, resulting in a cost effective, high-performance answer to the challenges of 28 Gbps and beyond. […]
Guidelines For Processing Micro Pitch Edge Card Connectors
Processing Micro Pitch Edge Card Connectors Processing micro pitch edge card connectors is easy, just like playing first base. Of course we know that’s a lie — manufacturing challenges increase as connector pitches decrease. Samtec recently released a 0.50 mm pitch edge card socket. The new MEC5 series (in vertical and right angle designs) is […]
Samtec Updates Silicon-to-Silicon™ Applications Solutions Gateway
Samtec’s growing portfolio of high-performance Silicon-to-Silicon™ Applications Solutions answer the design challenges of routing 56 Gbps signals through a system. However, finding the ideal solution in a single-click probably is an obstacle. Samtec last updated the Silicon-to-Silicon™ Microsite in early 2017. It gave engineers a one-stop shop summarizing the resources Samtec offers to optimize signal chains. […]
Samtec and Molex Share High Speed Product IP
Our friends at Signal Integrity Journal recently reported Samtec’s and Molex’s collaboration on high speed, next-generation data centers. The complete article is worth the read, but here’s the Cliff’s Notes version: SIJ referred to the Licensed Source Agreement for the Samtec Twinax Flyover™ and Molex BiPass™ systems fo high-speed data (56 Gbps and 112 Gbps) […]
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