From the top plays in sports to the top news stories, to the best of new electronic equipment and technologies, I love end-of-the-year lists. But compiling one of these lists can be easier said than done. Samtec published 142 blogs in 2022, and it's challenging to select the best connector blogs with so many good options to choose from. Several of us reviewed all of the options, and here's our list of Samtec's best connector blogs of 2022, based on our subjective definitions of "best." BTW, … [Read more...]
How Does Solder Reflow Affect RF Connectors?
Solder reflow plays an important role in the success and performance of high-bandwidth RF connectors. Sometimes, when a high-bandwidth RF connector is soldered together with an optimized PCB launch, the results can be unpredictable. It is important to investigate the root causes of solder reflow variation and analyze what techniques can deliver consistent performance across frequencies. In a new white paper from Samtec, “Impacts of Solder Reflow on High Bandwidth RF Connectors,” authors … [Read more...]
Characterizing High-Speed Digital Interfaces: Reflecting on Reflections
Today’s high-speed digital interfaces have become more sensitive to signal reflections. The result is a need to characterize and suppress channel and component discontinuities. How do you select a characterization method between those called out in standards such as PCIe, IEEE 802.3, and USB? In a DesignCon 2022 paper, Steve Krooswyk, Hansel Dsilva, Richard Mellitz, Stephen Hall, Adam Gregory, Beomtaek Lee, and John Riley aim to explain each reflection standard in regard to its history, use … [Read more...]
Ganged SMPM: New High Density, Push-On RF Solutions
Samtec recently released Magnum RF™, which are ganged, multi-position SMPM blocks and cable assemblies for millimeter-wave applications. Magnum RF is ideal when space is limited and a high operating frequency is required. Ganged SMPM When more than one channel is required, the ganged SMPM design provides 40% greater density, requires less processing time, and provides better positional alignment compared to individual SMPM connectors. SMPM (Sub-Miniature Push-on Micro), is about 33% … [Read more...]
Free Wideband RF Launches White Paper
Samtec recently published a major white paper, “Wideband RF Launches: Much More Than Footprints On PCBs.” This white paper shows that very wide bandwidth RF launches are possible to implement in PCBs, even with vias included. This does not mean it is a trivial task. Competing requirements, be they electrical, mechanical, manufacturing, or cost, must be considered and balanced simultaneously. This white paper -- a link to it is at the end of this blog -- elaborates on some of … [Read more...]
Samtec SI Technologists to Present at EDI CON Online 2022
"I'm lovin' it." "Can you hear me now?" "Just do it." "Where High Frequency Meets High Speed" The first three taglines are a part of pop culture lexicon. The last describes an annual technology event - EDICON Online 2022 - focused on training and informing engineers on that latest high-performance technologies, solutions, trends and design techniques. The world of high-frequency and high-speed is converging as never before. Real-world and modeled 224 Gbps PAMx system design … [Read more...]
Maximizing RF Launch Performance: The Impact Of GND Vias
(This is the third in a series of blogs, from Sandeep Sankararaman, Samtec’s Principal RF and Signal Integrity Engineer, discussing design strategies for high-bandwidth RF launches. The first is entitled “What Is An RF Connector Launch?” The second is "Via Stubs: Practical Strategies To Mitigate Return Loss.") A wide bandwidth RF launch requires a good ground ring structure around the signal via to maintain the impedance while the signal travels down the via. Figure 1 shows the ground ring … [Read more...]
Via Stubs: Practical Strategies To Mitigate Return Loss
(This is the second in a series of blogs, from Sandeep Sankararaman, Samtec’s Principal RF and Signal Integrity Engineer, discussing design strategies for high-bandwidth RF launches. The first is entitled "What Is An RF Connector Launch?" The third is "Maximizing RF Launch Performance: The Impact of GND Vias." coming next week, discusses GND rings.) When using a through via to transition to an internal layer, there is a stub created by the part of the via that extends below the transition … [Read more...]
What is an RF Launch?
As signal speeds increase, each part of the signal path getting to and from the device needs to work to higher frequencies. Strategies that worked in the past no longer suffice and cheaper connectors no longer make the cut. Cable lengths and trace lengths need to get shorter to reduce losses. This makes intuitive sense. However, what needs to be done with connectors to get them to perform better is not as straightforward. The selection and implementation of RF PCB … [Read more...]
Compact Components Enable Compact Drones
According to the Drones Industry Insights Report 2020, the worldwide drone industry is predicted to increase at a 13.8% CAGR to $42.8 billion by 2025. Advancements in sensor technology are fueling innovation in the drone industry. In addition, increased embedded Ethernet speeds (2.5 Gbps, 5 Gbps, and 10 Gbps) enable faster throughput for the multitude of sensors found in drones. However, for this technology to work, new innovations must be compact and light because extra weight on a drone … [Read more...]
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