Earlier this year, PICMG® announced the release of the new COM-HPC specification. COM-HPC (for “Computer on Module – High Performance Computing”) is an open standard for high performance computer modules targeting the embedded applications The development of COM-HPC exceeds the demand for high-speed performance in embedded computers. COM-HPC coexists with the COM Express® specification, but provides the scalability and enhanced performance for next-gen embedded system design. COM-HPC … [Read more...]
Otava Beamformer Technology Covers 24-40 GHz
Samtec, Otava, Rohde & Schwarz, and Avnet joined forces at IMS 2021 with a live demonstration of Otava’s OTBF 103 Wideband Beamformer IC Evaluation Kit. The Otava Beamformer IC covers 24 – 40 GHz. The wide bandwidth of the IC encompasses multiple 5G FR2 mmW bands, and also has applications in the Defense, SATCOM, and Instrumentation market spaces. The flexible design of the beamformer allows its performance to adapt to required specifications for these intended applications. The … [Read more...]
Knocking On The Door To 112 G PAM4
Channel rates have evolved from 28 Gbps NRZ to the current 56 Gbps PAM4, with 112 Gbps PAM4 in-development and knocking at the door. This live product demonstration shows the door is opening with a cutting-edge 112 G test chip and two new high-performance connector systems. It’s all driven by the Alphawave AlphaCORE 100 Long-Reach Multi-Standard SERDES. This is a high-performance, low-power, DSP-based PHY. The new connector products are the Samtec NovaRay® extreme density array … [Read more...]
New Waveguide Technology Proof-of-Concept Demonstration At IMS 2021
Samtec presented a proof-of-concept demonstration of our new waveguide technology at IMS 2021 in Atlanta, Georgia. In this video, filmed at the show, Mike Dunne, Samtec's Director of RF Business Development, gives us an update on the new technology and walks us through the demonstration. Although it's still in development, the demo garnered plenty of attention, and piqued a lot imaginations. With Vubiq and Analog Devices, this proof-of-concept demonstration shows our high-frequency micro … [Read more...]
112 Gbps PAM4 Rack-to-Rack Interconnect With Remarkable Results
Samtec Flyover® Twinax Cable assemblies allow designers to extend signal reach and density, enabling 112 Gbps PAM4 performance. Samtec Flyover systems are commonly used in mid-board applications, with a cable assembly connector located next to the chip. The signal path is directed to the front or back panel. Samtec Flyover also allows designers to go from one board to another as a flexible backplane architecture within a rack, and it can be used as a rack-to-rack interconnect. For … [Read more...]
New High Speed Connector System Performs At 112 Gbps PAM4
System architects and design engineers are interested in bleeding-edge performance. In this new 112 Gbps PAM4 product demonstration, Samtec marries the SI Evaluation Kit for the new AcceleRate® HP high speed connector system with Alphawave’s AlphaCORE 112 Gbps PAM4 Long Reach Multi-Standard SERDES. The test set-up emulates the real-world by routing differential pairs from the Alphawave SERDES through Samtec's AcceleRate HP High-Performance Arrays. Matt Burns, Technical Marketing Manager at … [Read more...]
IMS 2021: New Technologies, New Products
Samtec is proud to participate in IMS 2021, both in-person at the Georgia World Congress Center in booth 1241 on June 8 and 9, 2021, and virtually June 20-25. At IMS 2021, Samtec will present: Our newest Precision RF – Microwave/Millimeter Wave productsA live demonstration of Otava bleeding-edge beamformer technology. This is in partnership with Rohdes and Schwarz, and Avnet.A proof-of-concept of our High-Frequency Micro Waveguide technology, in partnership with Vubiq Networks.A live … [Read more...]
Practical Connector Characterization Techniques: SIJ Panel Discussion
Our friends at Signal Integrity Journal recently hosted a one-hour panel discussion on Practical Connector Characterization Techniques. It was moderated by Eric Bogatin, University of Colorado in Boulder, the Technical Editor for Signal Integrity Journal, and a Teledyne LeCroy Fellow. Many papers are published about building models of interconnect structures such as connectors. But what is done in practice? This panel gathered industry leading suppliers of connector components and … [Read more...]
56 Gbps PAM4 Connector Set: A New Live Demonstration
This live product demonstration shows a Samtec high-speed, high-density connector system running at 56 Gbps PAM4, with excellent performance. Adam Page, Software Architect at Samtec, walks us through this demonstration, which is powered by a Xilinx® Virtex® UltraScale + 56 Gbps PAM4 VCU 129 FPGA Evaluation Kit. The demo also includes a Samtec SI Evaluation Kit for the SEARAY™ high-density array products. SEARAY is a 1.27 mm pitch array connector system that allows maximum routing and … [Read more...]
Practical Ports for Perfect Performance – Pretend or Possible?
Enough of the letter "P" already. Message recieved. In any case, modeling and simulating next-gen 224 Gbps signal channels poses many challenges. Design engineers must optimize the entire signal path, not just a specific component. The signal path includes transceiver and receivers, die-to-packaging transitions, BGA breakout regions, PCB traces, connector breakout regions and interconnect. Any number of design decisions affect multi-gigabit per second channel data rate performance. As a … [Read more...]
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