I’ve been reading year-end and upcoming year lists about the future trends affecting technology and electronics. Topics run the gamut from expanding technologies like 5G, AI, electric vehicles, and various realities (XR, VR, MR), to external pressures like increased government regulation and tech nationalism. Just about every list mentioned the ever-increasing need for bandwidth to accommodate cloud computing services, video conferencing, video streaming, e-commerce, etc. While these … [Read more...]
Break Out Region Design By Inspection
Samtec gEEk® spEEk is a series of free online seminars, covering a wide-range of topics, all commercial-free. gEEk spEEk allows engineers the opportunity to interact with signal integrity thought leaders and experts like DesignCon Engineer of the Year Istvan Novak, Scott McMorrow, and a number of other Samtec engineering leaders. Travis Ellis, a Signal Integrity Engineer at the Samtec Wilsonville (OR) Cable Facility, recently presented "Break Out Region Design By Inspection." The purpose of … [Read more...]
Submer and Samtec: Smarter Connections
As we put 2020 in the rear view mirror, it's always a good time to look back. Here is a quick recap of a cool event: OCP Tech Week. In early November Scott Noteboom, CTO of Submer, presented on the topic, "Out of Sight Project: The Blind Mate Network Backplane." Scott's presentation utilized Samtec's ExaMAX® cable backplane for blind mating server blades in an immersion cooling environment. Submer and Samtec, together with 2CRSi, also showcased a new design solution towards fully … [Read more...]
Video-over-IP Systems Leverage Samtec Flyover® Technology
Next-gen video broadcast and Pro AV systems are increasingly becoming IP-based systems. Video-over-IP and Video-over-Ethernet both leverage economies of scale of packet-based systems in the data center. Video-over-IP systems typically use FPGAs and SoC as the main processing unit. FPGAs and SoCs solve many problems that legacy CPU-based systems can’t. In general, they are higher-performing, lower-power and more efficient at the system level Video broadcast and Pro AV systems must interface … [Read more...]
COM-HPC® is (Almost) Ready For Prime Time
Anticipation. That word conjures up many emotions. For some, a planned event brings hope and happiness. For others, that same event may cause anxiety and stress. Why isn't it HERE yet?!!!?!? (Maybe that is just this parent's view of their children's daily reactions. Insert "shrug" emoji here.) In any case, many in the embedded computing industry are looking forward to the soon-to-be-released PICMG COM-HPC specification. COM-HPC will soon provide increased density, enhanced … [Read more...]
New PCIe Gen 4 Over-Fiber Adapter Card
With the recent introduction of PCIe® Gen 4 servers and engineering work stations, designers require faster optical links for networking and accelerator interfaces. Samtec’s new PCIe Gen 4 adapter card doubles the speed over the Gen 3 card and easily plugs into any PCIe slot. Giri Tumu, Samtec’s Optics Application Engineer, walks us through a live demonstration of our latest Gen 4 optical PCIe product. The demo includes a PCIe Gen 4 server and a Non-Disruptive Migration (NDM) storage end … [Read more...]
FireFly Technology Enables Bandwidth in CERN LHC
UCLA's Maxx Tepper gives us a brief overview of the Ocean High-Throughput processor to be used in the upgrade of the real-time event selection system of the CMS experiment at the CERN LHC (Large Hadron Collider). The board incorporates Samtec FireFly™ optical cable assemblies. The project is part of the research program of the UCLA Physics and Astronomy Department, supported by the National Science Foundation. The board receives data from 500 detectors and reconstructs particle … [Read more...]
Samtec and Achronix Technologists Detail 112 Gbps PAM4 FPGA Implementation
Readers of the Samtec blog know we are always talking about next-gen speed. Current channels rates are running at 56 Gbps PAM4. However, system designers are starting to look at 112 Gbps PAM4 data rates. Intuition would say that bleeding edge data rates like 112 Gbps PAM4 only occur in the data center. Why might that not be the case? FPGA vendors are releasing any number of new solutions featuring 112 Gbps PAM4 transceivers. FPGAs reside in a number of applications like 5G, AI/ML, … [Read more...]
A Performance Comparison of Air-Cooled vs. Immersion Cooled Connector Systems
As computing power continues to increase, air cooled systems cannot meet current thermal requirements for HPC hardware systems. Power consumption, space and performance must all be considered during system design. Immersion cooling is a fast-growing solution to economically combat system heat, noise, power consumption and compute density. Samtec’s Brian Niehoff presented “Thermal Management of HPC Hardware Architecture via Immersion Cooling” at the Exhibitor Forum at SC20. Brian’s … [Read more...]
The Challenges Of A High-Speed RF Launch Design
Samtec has provided Final Inch designs for years at no cost. Final Inch is a reference design report for a PCB launch, or break-out-region (BOR), for one of our connectors. Obviously the BOR/launch must be carefully designed to allow for the best possible high-frequency performance. As we introduce new precision RF interconnects we continue to push the limits on mmWave test boards and the design of our RF Launches. I recently spoke with Kelly Garrison, Samtec's Principal RF Engineer, about … [Read more...]
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