What do the QSFP-DD800 MSA and VITA 57 have in common? Fair question. One focuses on defining the next-gen pluggable form factors while the other complements FPGA mezzanine applications. So what is the link? Samtec, of course! Samtec participates in many Industry Standards to develop commonality is specific applications. QSFP-DD800 and VITA 57 are but two examples. QSFP-DD800 MSA: New HW Spec QSFP28. QSFP-DD. QSFP-DD800. It seems the Multi Source Agreements (MSAs) for Quad Small … [Read more...]
A Cable Backplane Solution For 112 Gbps PAM4 Architecture
Scott McMorrow, CTO, Samtec Signal Integrity Group, walks us through a live demonstration of a cable backplane and mid-board cable system, both utilizing Samtec Flyover® . Samtec Flyover is most commonly used in mid-board applications, with the cable assembly connector placed close to the chip and direct the signal to the front panel through the cable. Cable Backplane and Mid-Board Applications Flyover also allows designers to go from one board to another as a flexible backplane … [Read more...]
Samtec Technology Centers Enable Complete System Optimization from Silicon-to-Silicon™
Integration Leads to Innovation Do you remember Magic Eye books from the 1990s? Each page featured a different autostereogram that brought a 3D image to life by staring at a 2D pattern. It was an eye-crossing exercise to see the “magic.” Similarly, Samtec’s Technology Centers are more than meets the eye, and we want to help you see the “magic” without the weird eye-crossing thing. Our Technology Centers are not so much physical locations as they are actual industry-leading experts. … [Read more...]
Optimizing 112 Gbps PAM4 Interconnect Design Leveraging ANSYS® HFSS™
It seems like everyone is thinking about the global coronavirus scare, and rightfully so. Workers, students and those most as risk are staying home. What are people doing at home? They are probably binge-watching their favorite video streaming service. It appears not even COVID-19 can slow consumers' insatiable demand for data. This puts constant pressure on internet providers, equipment vendors and components suppliers to develop higher-performance networks. Samtec is a global leader in … [Read more...]
OFC 2020: The Show Must Go On
Since we missed OFC 2020 and the opportunity to meet with our customers and blog readers in person, we decided to bring the show to you. We had an incredible booth planned with six live product demonstrations and multiple new product introductions. OFC has always been the single best place in the optics industry to meet with customers and partners, address the technical challenges with next generation systems, and demonstrate Samtec’s industry leadership. This time we had planned to … [Read more...]
Direct Connect To The Silicon Package
In this product demonstration from Design 2020, Keith Guetig, High-Speed Product Manager at Samtec, explains how Samtec Direct Connect™ technology enables 56 Gbps PAM4 and 112 Gbps PAM4 systems. 5G, high performance computing, emulation, AI and machine learning technology segments all benefit from bleeding edge speed and reach, especially at 56 and 112G PAM4. Direct Connect With Direct Connect, Samtec Flyover® cable assemblies plug directly into the chip package. This is an enabler for … [Read more...]
OCP 2020 and OFC 2020 Updates from Samtec
In a recent blog article, we mentioned that the global electronics trade show industry has been directly affected by COVID-19, the novel coronavirus. While all hoped the effect would be temporary, that does not appear to be the case. In recent days, the OCP Global Summit has been canceled. A number of coronavirus cases have broken out in Santa Clara County, CA. Additionally, Samtec will not be exhibiting at OFC 2020 in San Diego. A small team of Samtec technical experts will meet with … [Read more...]
A 112 Gbps PAM4 Connector Solution, Front Panel to Mid-Board
This demonstration from DesignCon 2020 shows a 112 Gbps PAM4 connector system which achieves outstanding results. Ralph Page, System Architect at Samtec, explains that this demo is a collaboration between Samtec and Alphawave. It emulates next generation data center equipment architectures, and incorporates Samtec Flyover® to improve signal integrity and architectural flexibility. Samtec Flyover routes critical high-speed signals from the ASIC, above lossy PCB materials, … [Read more...]
DesignCon 2020: A Recap
DesignCon 2020 wrapped-up a few weeks ago. DesignCon, which celebrated its 25th anniversary in January, is an important conference/exhibition for Samtec. It’s an opportunity to present our new signal integrity optimized, high-performance interconnect and technology solutions. Here are a few key observations and takeaways from DesignCon 2020, from a connector manufacturer’s perspective: 112 Gbps Data Rates Several years ago DesignCon was abuzz with cutting edge 28 Gbps data rates. … [Read more...]
Samtec Exhibits at Embedded World 2020
The global outbreak of the novel coronavirus is affecting many aspects of life. COVID-19 has even affected the electronic components trade show industry. In recent weeks, the Mobile World Congress, electronica Shanghai and other events have been canceled. Other events, like next week's Embedded World 2020, are still on. However, many exhibitors are choosing not to attend trade shows out of caution. For Embedded World 2020 specifically, the local Samtec team will be at the show in … [Read more...]
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