DesignCon 2024 recently highighted the ongoing trend for sending high-speed data over twinax cable assmblies. As AI/ML, HPC, data center and computing system architectures evolve, twinax cable assmeblies can be found in ASIC adjacent or near chip applications as well as solutions routing front-panel to front-panel. PCI Express® technology also is playing a key role in GPU-to-GPU communications as AI clusters become larger and disaggregated. Connecting GPU-based AI systems does and will … [Read more...]
New Front Panel, 112 Gbps PAM4 Cable Solution
Samtec has 10 connector systems – both cable-to-board and board-to-board -- that achieve outstanding performance at 112 Gbps PAM4 data rates. The 112 G cable systems are Samtec Flyover® solutions that are designed for mid-board, mid-board to front-panel, mid-board to back-panel, and panel-to-panel configurations. (Here's a link if you want to learn more about the benefits of Samtec Flyover) In this video, Matt Burns, Director of Technical Marketing, walks us through a live demonstration of a … [Read more...]
Connectors Address Challenges of 224 Gbps PAM4 Design
Delivering 224 Gbps PAM4 signals will require careful analysis of signal integrity and thermal effects, as well as the development of enabling technologies and new methodologies to achieve clean signals at these data rates. Industry-leading experts are focused on this topic, developing new technologies as well as products to handle high-speed data, and engaging in interoperability demonstrations at tradeshows, demonstrations of new products for 224 Gbps PAM4 systems, and numerous ongoing … [Read more...]
Samtec Sponsors Embedded Tech Trends
Embedded computing differs from general computing in one key way. Embedded computing solutions are typically tasked with a specific or dedicated function. An example may be monitoring environmental variables like humidity, temperature, barometric pressure and more in a factory. Embedded computing platforms like SoMs and CoMs constantly add functionality and capability. As a result, the difference between embedded and general computing may be blurred. It's a constant challenge to keep up with … [Read more...]
New Intel/Arrow AXE5-Eagle FPGA Dev Kit with Samtec Interconnects Ready to Ship
FPGAs are taking over the world, or it just seems that way. At least for readers of the Samtec blog. Samtec oftens gets questions as to whether we sell FPGAs or not. Of course we don't, but we do sell VITA 57.1 FMC and VITA 57.4 FMC+ interconnects found on just about every FPGA dev kit in the world. Samtec even offers a wide portfolio of FMC, FMC+ and optical module evaluation kits for real-time development and testing in a lab setting. So, the reader may ask, why does the Samtec blog … [Read more...]
CXL 3.0 AI Emulation Platform With Excellent Performance at 64 GT/s
Popular topics at SC23 included Exascale and quantum computing, AI and machine learning, and cybersecurity, among others. CXL is one of those hot topics. Largely used by designers of data center servers, supercomputers, and enterprise computing systems for applications like AI and machine learning, CXL enables cache coherency between CPUs and external devices. CXL 3.0 leverages PCIe® 6.0 electrical and physical layers at 64 GT/s. It also improves latency in memory … [Read more...]
COM-HPC 1.2 Specification Defines New COM-HPC Mini Form Factor
"I shall call him . . . Mini-Me." Fans of 1990s pop culture know that line forever changed the Austin Powers movie trilogy. All the same traits and qualities of the origial in one-eighth the size. Decades later, "Mini-Me" is still a part of the English lexicon. 1990s movie trilogies do not typically influence the technical development of industry standards. Yet, the latest PICMG COM-HPC 1.2 specification certainly tries. ;) A new, small form factor - COM-HPC Mini - targeted at high-growth … [Read more...]
New CXL Over Fiber Solution
A live product demonstration of CXL over fiber garnered a lot of attention at SC23. Other popular demos included a 224 Gbps PAM4 solution, and a proof-of-concept 128 GT/s (PCIe® 7.0) high-speed cable system. CXL is based on the PCI Express specification physical and electrical interface. CXL enables cache coherency between the CPU and attached devices, such as accelerators, GPUs, or memory devices. Emerging storage and memory use cases demand high performance, low … [Read more...]
New Proof-of-Concept High-Speed Cable Solution Performs At 128 GT/s
The upcoming PCIe® 7.0 specification is intended to enable 128 GT/s data rates. It continues PCIe’s trend of double speeds every generation. According to PCI-SIG, "PCIe 7.0 technology is targeted to be a scalable interconnect solution for data-intensive markets like Artificial Intelligence/Machine Learning, Data Center, HPC, Automotive, IoT, and Military/Aerospace."(1) PCIe 7.0 is targeted for release in 2025, and it probably won’t be in devices until 2027. But, at SC 23 in Denver, Samtec … [Read more...]
New 224 G Interconnect Family In A Live Product Demonstration
Emerging system requirements are driven by industry advancements in areas such as data centers, artificial intelligence, machine learning, and quantum computing, among others. Samtec 224 Gbps PAM4 interconnect systems are carefully designed to satisfy these high-performance requirements, as you’ll see in the video. Ralph Page, Systems Architect at Samtec, gives an overview of what is possibly the world’s first public demonstration of an asynchronous 224 G system. This 224 G demo is from … [Read more...]
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