Slim, High-Density Connectors: New Stack Heights and Pin Counts
Samtec’s ADM6 and ADF6, AcceleRate® HD array connectors—known for their slim profile and high-density 0.635 mm pitch—are now available with expanded stack height options ranging from 5 mm to 16 mm and pin counts from 40 to 400 positions. The product offering expansion allows design flexibility with quick delivery, supporting applications such as datacom, high-performance computing (HPC) servers and storage, and industrial and military systems.
Versatility Meets High-Speed Reliability
The range of stack heights available with our AcceleRate® HD array connectors match those of many popular Samtec interconnects in support of mixed signal digital, RF and power applications where sensing, processing and power delivery coexist. Another way to maximize signal routing opportunities is to take advantage of the open pin field, which places contacts in a grid pattern within a single connector housing. Designers can then choose a single-ended, differential pair and power configuration that best suits their application requirements.
Performance (mechanical and electrical) is another key benefit of Samtec’s AcceleRate® HD array products. This has a lot to do with the unique contact system design. The contact system, known as our Edge Rate® contact system, optimizes signal integrity to 64 Gbps PAM4 (PCIe® 6.0/CXL® 3.2 capable). It also improves cycle life. Following are a few design features of the contact system that make this possible:
- A smooth, milled mating surface that reduces wear
- Enhanced durability results in higher mating cycles
- The narrow edge of the contacts are aligned within the connector body, which reduces broadside coupling and crosstalk
Now, moving from the contact mating area down to the contact tail, we see that ADM6 and ADF6 connectors use Samtec’s column tail (-0: Column), which IPC refers to as a post. Once reflowed, an IPC Class 3 compliant joint is formed. This is known as Samtec’s solder column board termination. Solder column board termination is ideal for dense, high-speed interconnects and offers superior solder joint reliability and excellent insertion loss and return loss performance. A comprehensive understanding of mechanical integrity of the solder joint was obtained by observing coefficient of thermal expansion (CTE) mismatch during a months-long Solder Joint Reliability test, which exposed the joint to -55 to +125 degrees Celsius ramp and dwell cycles. Results confirmed the outstanding performance of Samtec’s solder column board termination. Details can be further examined in our white paper.
Part Availability
Samtec’s ADM6 and ADF6, AcceleRate® HD array connectors are available direct with 1-day shipping using our Reserve™ program. Parts are also accessible through authorized distributors. For help selecting the right interconnect to purchase, visit our Series pages (ADM6 and ADF6). At each Series page you can configure your part, check Reserve™ Program stock and distributor stock, and review pricing. And, as always, if there are ever any questions then please feel free to reach out. Simply email [email protected].
