A popular demonstration at Super Computing 2019 (SC19) was a collaboration between Samtec and eSilicon that emulates next generation data center architectures for typical 19 inch rack-mount applications. In the video above, Ralph Page, Systems Architect at Samtec, walks us through this chassis-to-chassis demonstration that shows mid-board connectivity via a five meter cable backplane architecture. It utilizes Samtec Flyover® to extend signal reach and density to achieve these next gen … [Read more...]
Parting Thoughts from SC19
SC19 has come and gone. Anticipation for SC20 in Atlanta is already building. Before we look ahead, what were some highlights from SC19? AI is Everywhere AI is affecting all aspects of life. At SC19, technical presentations showed how AI and HPC are helping researchers cure heart disease, predict weather patterns more accurately and make the best stock trades on Wall Street. From Samtec's perspective, the high-speed physical layer connectivity must perform as expected for AI … [Read more...]
56 Gbps PAM4 Connector Product Demonstration
In the video above Ralph Page, Systems Architect at Samtec, walks us through a live product demonstration that received a lot of attention at Super Computing 2019. Ralph discusses several Samtec 56 Gbps PAM4 connector solutions and shares some incredible results. The system can also run up to 28 Gbps NRZ. This is a fully-packaged system that populates signal paths using real-world signal integrity design practices. It demonstrates up to 56 Gbps PAM4 signaling, utilizing Samtec Flyover® … [Read more...]
Samtec Exhibits at XDF 2019 Asia in Beijing
The global XDF technology road shows come to Beijing next week. FPGA designers, system architects, data scientists and other technical leaders will gather December 3-4, 2019 at the China National Convention Center. Samtec technical experts and our partners will demonstrate some of the latest interconnect solutions affecting the Xilinx FPGA ecosystem. Samtec Interconnect on Xilinx Kits One of several demonstrations at XDF 2019 Asia shows the variety of Samtec interconnects … [Read more...]
Samtec Releases New Interconnect Evaluation and Development Kits
FireFly™, ExaMAX® and Bulls Eye®, oh my! So, obviously, that is one geek's riff on a popular song in The Wizard of Oz. Dorothy, Scarecrow and Tinman were anxious for what came next on their walk down the Yellow Brick Road. Similarly, Samtec engineering customers are also anxious and excited. For what? Samtec's latest evaluation and development kits. Who wouldn't be anxious and excited? Samtec has released a number of new kits. These include solutions for RF test point systems, optical … [Read more...]
SC19: Samtec Launches New 56/112 Gbps PAM4 Demos
Scientists, researchers, and data analysts from academia, industry and government agencies will be center stage at SC19 next week in Denver. SC19 is the International Conference for High Performance Computing, Networking, Storage, and Analysis. Next-generation high-performance copper and optical interconnects must solve multiple technical challenges including higher data rates, increased system and chassis density and improved signal integrity. Samtec’s diverse product and technology … [Read more...]
We Have The Power!
I recently attended the Engineering Design Show in the UK, where one of the clear trends in evidence was the rise of power connectors for printed circuit boards (PCBs). The reasons are pretty clear. New technology is making ever-greater demands for more power in smaller spaces. The march towards miniaturisation continues, while at the same time users want systems with more and more functionality. Modern applications are placing demands for power delivery to the printed circuit board … [Read more...]
New 112 Gbps PAM4 NovaRay™ SI Eval Kit Featured at Keysight Event
"112 Gbps PAM4 data rates will save the world!" A reader of the Samtec blog may think that. Why? The demand for data never ceases. A recent report says that US teenagers spend seven hours a day in front of screens. But how real are 112 Gbps PAM4 data rates? Test silicon is available from a few SerDes and FPGA vendors. Production silicon is at least 18 months away. However, 112 Gbps PAM4 data rate system design and testing are already underway. The SI requirements for next-gen … [Read more...]
AI, 5G and Automotive – Dispatches from XDF Silicon Valley
The FPGA (or ACAP) universe gathered at the San Jose Fairmount last week during the Xilinx Developer Forum. Engineers, data scientists, analysts, distributors, alliance partners and more came to learn about the latest hardware, software and system level solutions from Xilinx. Xilinx CEO Victor Peng set the theme of the event with his keynote. Xilinx (and thier partner's) business strategies revolve around three key growth drivers: Data Center, 5G and Automotive. The Samtec team … [Read more...]
Samtec Expands VITA 57.4 with FMC+ Extender Card
Developing with FPGAs requires patience. Why? They are so flexible and configurable. System designers are only limited by their imagination. Prototyping with FPGAs also poses many challenges. It seems like there are new FMC / FMC+ solutions appearing daily. Sometimes the FPGA carrier card or development board can get crowded. How can that be fixed? VITA 57.4 FMC+ Extender Card Engineers prototyping with industry-standard FPGA evaluation and development kits often leverage the FMC+ … [Read more...]
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