Embedded computing differs from general computing in one key way. Embedded computing solutions are typically tasked with a specific or dedicated function. An example may be monitoring environmental variables like humidity, temperature, barometric pressure and more in a factory. Embedded computing platforms like SoMs and CoMs constantly add functionality and capability. As a result, the difference between embedded and general computing may be blurred. It's a constant challenge to keep up with … [Read more...]
New Intel/Arrow AXE5-Eagle FPGA Dev Kit with Samtec Interconnects Ready to Ship
FPGAs are taking over the world, or it just seems that way. At least for readers of the Samtec blog. Samtec oftens gets questions as to whether we sell FPGAs or not. Of course we don't, but we do sell VITA 57.1 FMC and VITA 57.4 FMC+ interconnects found on just about every FPGA dev kit in the world. Samtec even offers a wide portfolio of FMC, FMC+ and optical module evaluation kits for real-time development and testing in a lab setting. So, the reader may ask, why does the Samtec blog … [Read more...]
COM-HPC 1.2 Specification Defines New COM-HPC Mini Form Factor
"I shall call him . . . Mini-Me." Fans of 1990s pop culture know that line forever changed the Austin Powers movie trilogy. All the same traits and qualities of the origial in one-eighth the size. Decades later, "Mini-Me" is still a part of the English lexicon. 1990s movie trilogies do not typically influence the technical development of industry standards. Yet, the latest PICMG COM-HPC 1.2 specification certainly tries. ;) A new, small form factor - COM-HPC Mini - targeted at high-growth … [Read more...]
Living On The Edge Rate
Edge Rate® is one of Samtec's most popular high-speed, high-bandwidth interconnect systems. Edge Rate is both the name of the pin and in this case, it’s also a product family. Edge Rate Contact Design Let’s begin with the contact system because that’s the star of the show. With some connectors, the mating edge of the contact is the cut edge of the pin. If you look at the edge under a microscope you may see micro burrs and edges. This reduces the life of the connector because … [Read more...]
Validating the Performance of Miniature Array Connectors
Small, complex, and portable applications (in industries such as military/aerospace and medical) require miniaturized, reliable interconnects. As traditional surface-mount and through-hole interconnects reach their limits in terms of density and the number of signals that can effectively be used, many product designers are implementing high I/O array styles of interconnects. In a new white paper from Samtec, “Improved Solder Joint Integrity for High-Density Interconnect Applications,” the … [Read more...]
Samtec Presents, Exhibits at Upcoming PCI-SIG DevCon on Santa Clara
Samtec is proud to sponsor the upcoming PCI-SIG Developers Conference 2023. Like last year, the event will be in-person with demonstrations, presentations and networking oppotunites. Past attendees agree that PCI-SIG DevCons are not to be missed! PCI-SIG DevCons are free events for the 900+ PCI-SIG member companies like Samtec that develop and bring to market new products utilizing PCI Express® technology. They are an opportunity to learn directly from the … [Read more...]
New prodesign Acceleration Card Includes Samtec NovaRay® Extreme Density Arrays
The recent popularity and interest in ChatGPT underscore the progress AI has made in affecting everyday life. Who has asked ChatGPT to finish a homework assignment or write a blog? (For full disclosure, this blog has been written by a real person. Or has it? 😉) In any case, the backbone of chatbots like ChatGPT and similar services are high-performance compute platforms enabling neural networks and AI acceleration in data centers. Obviously, GPUs have a leadership position in AI hardware … [Read more...]
Samtec Releases New Evaluation and Development Kits
Readers of the Samtec blog know that the demand for data keeps increasing. Rightly, data center applications may be the first to enter one's mind. However, faster speeds are required in AI/ML, Mil/Aero, Automotive, Medical, Instrumentation, and many other applications as well. Engineers developing new products at higher speeds need reassurance that the components they select work as advertised. Samtec-designed Evaluation and Development Kits simplify the interconnect design process and reduce … [Read more...]
Cutting Edge High-Speed Cable Performance Measured By The World’s First 53 GHz Scalable VNA
In this live demonstration from DesignCon 2023, the performance of a Samtec high-speed cable system is measured by the world’s first scalable VNA. Matt Burns (Technical Marketing Manager, Samtec), and Mike Resso (Signal Integrity Application Scientist, Keysight) explain the demo and equipment. The scalable VNA is Keysight's Digital Interconnect Test System, with 16 ports that are expandable to 32 ports at 53 GHz. In this demonstration, Mike has calibrated all 16 ports of the Keysight PXI-VNA … [Read more...]
Improve Power Integrity and Signal Integrity With New Interconnects
A new connector system improves signal integrity by improving power integrity. Optimizing power integrity provides greater signal integrity margin and improves power and thermal efficiency. The design of a high-speed connector system's breakout region, or BOR, impacts signal integrity. The BOR of a power connector also impacts signal integrity. How do we create a BOR that minimizes parasitic inductance? PI + SI: A New Connector In this video from DesignCon 2023, Alex Wroten, … [Read more...]
- 1
- 2
- 3
- …
- 14
- Next Page »