In the past few weeks, I have found myself attending several FPGA-themed technical events. Adam Taylor brought his fast-growing FPGA Horizons event to New England. AMD is in the middle of its Embedded Computing Summit series. FPGAs are everywhere, or so it just seems. FPGA-based designs offer many advantages. They offload computing requirements from CPUs,…
I like fast cars. Each new car I buy seems to have more horsepower. More speed isn’t needed when driving to the grocery store, but it’s nice to have when passing the overburdened minivan in front of you. In a similar vein, the updated COM-HPC 1.3 specification from PICMG offers a pathway to increased throughput…
The embedded computing industry has reached a major milestone with the ratification of the ANSI/VITA 90 (VNX+) family of standards. Announced on February 19, 2026, by VITA, this new standard represents a significant leap forward in compact, rugged, high‑performance embedded design. Samtec interconnects were selected for the VNX+ VITA 90 standard to improve signal integrity,…
New years lead to new goals. As an technologist, I always need to stay on the bleeding edge. That’s require constant diligence, and it can be quite a challenge. Webinars always help. As the calendar flips into 2026 new products, industry standards, design techniques and more are coming down the pike. As always, engineers, technicians,…
Samtec’s ADM6 and ADF6, AcceleRate® HD array connectors—known for their slim profile and high-density 0.635 mm pitch—are now available with expanded stack height options ranging from 5 mm to 16 mm and pin counts from 40 to 400 positions. The product offering expansion allows design flexibility with quick delivery, supporting applications such as datacom, high-performance…
Mixed signal applications—where sensing, processing and power delivery coexist—have become common due to the rapid growth of wireless communication and sensors in complex electronics systems. Whether in aerospace, automotive, or high-performance computing, designers face the challenge of maintaining signal integrity, minimizing noise, and optimizing layout across differing types of signal communication. Due to the high…
Software defined radio (SDR) requirements are starting to exceed the performance capabilities of many traditional RF components. This challenge invites RF system architects to select connectors that were originally designed to meet the demanding signal integrity specifications of high-speed digital applications. This blog highlights some key details from a recent case study. The study explains…
Samtec is excited to introduce you to the newest members of its AcceleRate HP® high-performance array family: 800-position APM6, APF6 at a 5 mm stack height. The AcceleRate HP® connector set delivers exceptional signal integrity performance and density (112 Gbps PAM4, 0.635 mm pitch). It’s an ideal solution for any system requiring extremely high data…
Yes. Contact wipe is a crucial element to examine during the interconnect design and development process. Qualification testing and understanding that sufficient wipe is achieved within a mated connector set provides confidence that interface surfaces will be cleaned of build-up and contamination in end applications. Interconnect companies, like Samtec, consider contact wipe during product development…
As I type (and yes, I am typing; this is not an AI-generated blog), PCIe 7.0, version 0.9, is now available to PCI-SIG members. PCIe 7.0® offers a 2x bandwidth boost over PCIe 6.0, reaching 128 GT/s raw bit rates. PCIe 7.0 addresses the growing demand for faster data transfer rates and lower latency, particularly…
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