Samtec continues to expand its line of shielded interconnects, both board-to-board and cable-to-board systems. These are used in a variety of industries and applications, one being industrial equipment. Shielded interconnects are a good thing because EMI is a four-letter word for most designers. I do and don’t mean that literally, although I do know there […]
High Speed Interconnect Demos At Electronica 2018
Samtec’s full line of high speed interconnect products was on display and in demonstrations at Electronica 2018. Focus products included high speed mezzanine high speed cable assemblies high speed backplane connectors active optical cable assemblies Two of the demos that caught a lot of attention were the 28 G Product Demonstrator and the REFLEX CES Sargon […]
New Products, New Technologies, New Location At Electronica
Samtec is presenting new products and new technologies at Electronica 2018, as well as our full line of interconnects including High Speed Board-to-Board, High Speed Cable Assemblies, Micro/Rugged, Flexible Stacking, Optics and Precision RF. We are in a new location this year: we’re still in Hall B3, but we’re now at Stand 129, across from Molex. If […]
Innovative High Speed Solutions With One Up Studio
One Up Studio is a hardware design engineering provider with a focus on signal integrity, and not coincidentally, a Samtec customer. I caught up with Paul Monar, the owner, to pick his brain about some interesting design challenges he faces at One Up and his connector system selection criteria. DANNY: What type of customers use […]
New Avnet UltraZed-EV SoM Features Samtec SEARAY™ 0.80 mm High-Density Arrays
Samtec distributor partner Avnet recently released its new UltraZed-EV Starter Kit targeted at embedded vision applications. Comprised of the UltraZed-EV SoM and the UltraZed-EV Carrier Card, this kit offers engineers and designers a complete platform for prototyping and evaluating embedded video processing systems. The Avnet development team worked with Samtec to identify SEARAY™ 0.80 mm Pitch […]
Guidelines For Processing Micro Pitch Edge Card Connectors
Processing Micro Pitch Edge Card Connectors Processing micro pitch edge card connectors is easy, just like playing first base. Of course we know that’s a lie — manufacturing challenges increase as connector pitches decrease. Samtec recently released a 0.50 mm pitch edge card socket. The new MEC5 series (in vertical and right angle designs) is […]
Extreme Density, Micro Edge Card Socket for Cost Optimization
Samtec has released the industry’s first 0.50 mm pitch edge card socket with justification beam. This design allows high-speed signals to pass through an incredibly dense connector while keeping the mating PCB at a reasonable cost. The socket’s justification beam is designed to shift the card into proper alignment with the contacts. This allows for […]
56/112 Gbps PAM4 Modular System Architecture With Samtec Flyover
Modular System Architecture Traditional communication and switch architecture leverages integrated designs in a single high-speed PCB, but this architecture is beginning to face signal integrity and thermal challenges at 56 and 112 Gbps PAM4. Samtec Flyover™ QSFP-DD solutions offer improved signal integrity and enable new modular system architectures, which also improve thermal efficiencies and […]
Samtec Exhibits Technical Breadth at Embedded World 2018
One of the largest events in the embedded electronics industry – Embedded World 2018 – occurs from Nuremberg this week. More than 1,000 exhibitors, including Samtec, will showcase new products and innovations across the spectrum of the embedded applications. Samtec will exhibit its growing technical breadth at Embedded World 2018 in Hall 4A, Stand 4A-240. New […]
Analog Devices Expands the FMC and FMC+ Ecosystem
Regular readers of the Samtec blog are keenly aware of VITA 57 FMC and FMC+ solutions Samtec offers. For more than 10 years, this standard has defined the interface between FPGAs and various expansion modules in a growing number of applications. As FMC/FMC+ leverages open platforms and standards, developers are working to further the adaptation […]
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