Mezzanine Stacking Connectors for Mixed Signal Applications
Mixed signal applications—where sensing, processing and power delivery coexist—have become common due to the rapid growth of wireless communication and sensors in complex electronics systems. Whether in aerospace, automotive, or high-performance computing, designers face the challenge of maintaining signal integrity, minimizing noise, and optimizing layout across differing types of signal communication.
Due to the high density of most mixed signaling applications, choosing robust interconnects that function well side-by-side within the same mezzanine board stack can sometimes be a challenge. Once the general type of RF, digital or power interconnect is identified, finding ones with complimenting stack heights is often the next selection criteria.
At Samtec, we’ve carefully designed our RF/analog connectors to have matching stack heights to their digital, power counterparts. To make the interconnect selection process easier, we’ve pulled together a list of our most common stack heights and connectors. The list may be viewed from our new Mezzanine Stacking Connectors brochure.
As you will notice, common stack heights are 9 mm, 10 mm, 11 mm, 12 mm & 16 mm. A few examples of some of our most popular Samtec products at those stack heights include:
- UMPT / UMPS mPower® ultra micro power connectors
- SFM / TFM rugged Tiger Eye® strips
- TW / MMS classic terminal/socket strips
- APM6 / APF6 AcceleRate® HP high-performance arrays
- SMP RF connectors with true DC to 40 GHz performance
When pairing multiple connectors together onto a single printed circuit board, we’ve found that applying certain considerations early on in the design process can help ensure overall success. Below are a few of those considerations. However, if there are ever any questions specific to using multiple Samtec connectors in the same mezzanine stack, please feel free to reach out to our Application Support Group at [email protected].
Tips & Considerations
- Perform a detailed tolerance stack-up analysis long before manufacturing begins
- Use guideposts or standoffs in your mezzanine stack (we recommend selecting from our SureWare rugged hardware products)
- Place guideposts or standoffs close to the connector system to decrease PCB stress
- Ensure the analog connector mates first with zero gap, preventing unwanted discontinuities
- Employ effective shielding and dedicated grounds for optimal system signal integrity
- Confirm proper connector contact wipe for clean, reliable mating
Analog Over Array™
Another consideration is to take an Analog Over Array™ approach, which is to use a single array connector with an optimally designed breakout region. Analog, digital and/or power signals can be carried over the array connector simultaneously as a replacement for traditional connectors. This works well with frequencies to approximately 8 GHz when crosstalk and return loss requirements are less stringent. Analog Over Array™ reference design kits are available for our SEARAY™ high-density array product. Reference designs using other Samtec array products at higher frequencies are in development.
Looking Ahead
As mixed-signal systems evolve, interconnect technologies must keep pace. Advances in connector miniaturization or density while enabling higher data rates, along with better mechanical integration and reliability are important. Equally important is making those interconnect solutions easy to locate and source. That’s where Samtec has you covered. Our connectors are available direct with 1-day shipping on many products using our Reserve™ program. Parts are also accessible through authorized distributors. For help selecting the right interconnect to purchase, visit our Solutionator® product selection tools to locate a mated set in seconds.
