SC25 and Samtec: New Products, Technologies, Next-Gen Performance
We’re looking forward to SC25. SC25 is the international event for high-performance computing, networking, storage, and analysis.
Samtec will present its full line of high-performance connectors for HPCs, including 224 Gbps PAM4 solutions, 112 Gbps mid-board optical transceivers, and PCIe 7.0 interconnect systems, among others. Here’s a quick recap of what you’ll see at the Samtec booth, #2339.
Demonstration of 200G Co-Packaged Copper Channel
This is a live product demo in conjunction with our friends at Broadcom. This evaluation platform incorporates Broadcom’s industry-leading 224 Gbps SERDES technology and Samtec’s Si-Fly high-density co-packaged copper cable systems.
Si-Fly® HD co-packaged copper (CPC) boasts the industry’s highest footprint density, with a robust interconnect, enabling 102.4T — that’s 512 lanes at 200G in a 95 x 95 mm or smaller chip substrate.
It’s designed for a wide range of data center, high-performance computing, artificial intelligence, hyperscale, and machine learning applications.
BTW, we recently named Molex as a second source on the Si-Fly-HD.
112 Gbps PAM4 Mid-Board Optical Transceivers
Samtec Halo® is a mid-board optical transceiver designed for next-gen embedded applications requiring 56/112 Gbps PAM4 performance in low-profile and ruggedized form factors. Here are a few more fun facts about Halo:
- Up to 16 channels and 56 & 112 Gbps PAM4 performance per lane
- Protocol agnostic
- Low-profile designs for space savings
- Designed to withstand high shock and vibration with a rugged 2-piece contact system
- Supports data center, HPC and FPGA Protocols, including 10/40/100 (400/800 optics only) Gb Ethernet, InfiniBand™, Fibre Channel, PCIe®, CXL® and Aurora
- Halo® socket connector features up to 76 pins in a single row around the perimeter for vertical mating with Halo® optical and Halo Cu™ copper systems.
PCIe 7.0 Interconnect Solutions
This live demo showcases six Samtec connector systems, all operating at PCIe 7.0 data rates. It includes board-to-board connector sets, as well as four Samtec Flyover® cable systems.
The mezzanine connector systems are Samtec NovaRay® and AcceleRate® HP products. Here’s a link to learn more about Samtec high-speed board-to-board (mezzanine) interconnects.
The Samtec Flyover cable systems are:
- NovaRay I/O is a 128 Gbps PAM4 front panel mount cable system.
- ExaMAX is a high-speed cable backplane system
- Si-Fly® LP is Samtec’s lowest profile Flyover® cable solution capable of residing adjacent to the IC package, under heat sinks or other cooling hardware.
- FQSFP is Samtec’s Flyover QSFP cable system (also available in FQSFP-DD).
New 1.6 Tbps OCP OAI EXP Module
We are showing our new Fireblade OCP OAI EXP Module as part of a full OAI chassis. It provides low-latency, protocol agnostic, 1.6 Tbps aggregate throughput in a compact form factor ideal for AI/ML system topologies.
The module supports Data Center, HPC, and FPGA-to-FPGA protocols, including Ethernet, InfiniBand™, Fibre Channel, PCI Express®, and CXL®. It typically requires half the power of MSA-style optics. Each OCP OAI Universal Baseboard (UBB) can accommodate up to eight FireBlade™ FireFly™ OCP OAI EXP Modules.
224G Test Platform
A 224G test configuration, incorporating a 110 GHz Samtec Bulls Eye® test point system and ISI Evaluation Board, provides superior cost benefits, ease of use, and scalability for validating today’s leading-edge silicon interface IP.
Products like the Samtec Bulls Eye ISI Evaluation board, Bulls Eye system, and Si-Fly® HD high-speed cable system are designed for 224 Gbps PAM4 and provide a pathway to 448 Gbps.
We hope you can join us in St. Louis at SC25. If not, you can find all of the products above on our website.
