Samtec Inks Second Source Agreement With Molex on 224 Gbps Si-Fly HD

Samtec, Inc. and Molex announced a license agreement naming Molex as a second source for the Samtec Si-Fly^® HD 224 Gbps PAM4 product family. Here is a link to Samtec’s press release: “Samtec Inks Second-Source License Agreement with Molex to Expand Reach of Si-Fly HD High-Speed Interconnects for Data Center and AI Applications.”

The Samtec Si-Fly^® HD product family delivers industry-leading signal integrity for high-speed applications, supporting data rates critical for modern networking, communications, and computing systems.

Si-Fly HD co-packaged copper (CPC) boasts the industry’s highest footprint density, with a robust interconnect, enabling 102.4T — that’s 512 lanes at 200G in a 95 x 95 mm chip substrate. Co-packaged copper or optics (CPX) offers the lowest signal loss transmission from the package to the front panel or backplane while providing the highest density.

Samtec recently presented a ground-breaking next-gen 100T network switching topology at OFC 2025, incorporating Samtec co-packaged connectivity at the substrate level. This was presented in conjunction with our network switching partners at Marvell, and incorporated Samtec Si-Fly HD 224 Gbps PAM4 interconnects.

Samtec also presented a live product demonstration of a 200G co-packaged channel at DesignCon 2025. It incorporated our Si-Fly HD co-packaged copper cable systems and Broadcom’s 200G SerDes technology.

The Samtec, Molex collaboration provides customers with extended product availability and supply flexibility to a portfolio of scalable connectivity solutions for a wide range of high-performance applications that demand high signal integrity and density.

Here are links to other blogs that may be of interest:

• Samtec’s Open Book Approach: Flyover^® Cables in OCP Demo Rack
• Samtec Si-Fly HD Connector Supports 224 Gbps PAM4 with Excellent Performance
• 224G Test Platform Provides Scalability, Cost Benefits, Pathway to 448G
• Is the Path to 448 Gbps Clear?
• Signal Integrity Journal Article, based on the DesignCon 2025 Best Paper: Path to 400G May Require Alternative Architectures