SC19 has come and gone. Anticipation for SC20 in Atlanta is already building. Before we look ahead, what were some highlights from SC19? AI is Everywhere AI is affecting all aspects of life. At SC19, technical presentations showed how AI and HPC are helping researchers cure heart disease, predict weather patterns more accurately and make the best stock trades on Wall Street. From Samtec's perspective, the high-speed physical layer connectivity must perform as expected for AI … [Read more...]
56 Gbps PAM4 Connector Product Demonstration
In the video above Ralph Page, Systems Architect at Samtec, walks us through a live product demonstration that received a lot of attention at Super Computing 2019. Ralph discusses several Samtec 56 Gbps PAM4 connector solutions and shares some incredible results. The system can also run up to 28 Gbps NRZ. This is a fully-packaged system that populates signal paths using real-world signal integrity design practices. It demonstrates up to 56 Gbps PAM4 signaling, utilizing Samtec Flyover® … [Read more...]
Samtec Exhibits at XDF 2019 Asia in Beijing
The global XDF technology road shows come to Beijing next week. FPGA designers, system architects, data scientists and other technical leaders will gather December 3-4, 2019 at the China National Convention Center. Samtec technical experts and our partners will demonstrate some of the latest interconnect solutions affecting the Xilinx FPGA ecosystem. Samtec Interconnect on Xilinx Kits One of several demonstrations at XDF 2019 Asia shows the variety of Samtec interconnects … [Read more...]
Samtec Releases New Interconnect Evaluation and Development Kits
FireFly™, ExaMAX® and Bulls Eye®, oh my! So, obviously, that is one geek's riff on a popular song in The Wizard of Oz. Dorothy, Scarecrow and Tinman were anxious for what came next on their walk down the Yellow Brick Road. Similarly, Samtec engineering customers are also anxious and excited. For what? Samtec's latest evaluation and development kits. Who wouldn't be anxious and excited? Samtec has released a number of new kits. These include solutions for RF test point systems, optical … [Read more...]
SC19: Samtec Launches New 56/112 Gbps PAM4 Demos
Scientists, researchers, and data analysts from academia, industry and government agencies will be center stage at SC19 next week in Denver. SC19 is the International Conference for High Performance Computing, Networking, Storage, and Analysis. Next-generation high-performance copper and optical interconnects must solve multiple technical challenges including higher data rates, increased system and chassis density and improved signal integrity. Samtec’s diverse product and technology … [Read more...]
Is Copper Dead?
In 1995, I attended a seminar in which the presenter told us that copper was dead. This sort of statement is not new. The connector market is filled with armchair pundits who predict the demise of everything from D-Subminiature connectors (which are very much alive and kicking) to the V.35 telecommunications connector (which is as dead as the Dodo). This just goes to prove that it is almost impossible to predict the future trends of this industry with any certainty. Making … [Read more...]
AI, 5G and Automotive – Dispatches from XDF Silicon Valley
The FPGA (or ACAP) universe gathered at the San Jose Fairmount last week during the Xilinx Developer Forum. Engineers, data scientists, analysts, distributors, alliance partners and more came to learn about the latest hardware, software and system level solutions from Xilinx. Xilinx CEO Victor Peng set the theme of the event with his keynote. Xilinx (and thier partner's) business strategies revolve around three key growth drivers: Data Center, 5G and Automotive. The Samtec team … [Read more...]
Samtec and Partners to Demonstrate 56/112 Gbps PAM4 Systems at ECOC 2019
The optical communications world will be centered in Dublin next week for ECOC Exhibition 2019. This is one of "the" events in the fiber optics world. ECOC features over 6,000 attendees and 330 exhibitor from around the globe. The industry will focus on networking, sharing ideas, learning and developing new business leads. Samtec and its partners will be demonstrating next-gen 56/112 Gbps PAM4 solutions in a variety of applications. As data rates get faster, Samtec's Flyover® … [Read more...]
A 112 Gbps High-Density Escape From The System ASIC To The Front Panel
In this video from EDI CON 2109, Samtec's Jignesh Shah explains how Samtec Flyover® offers a 112 Gbps high-density escape from the system ASIC to the front panel. This is a live demonstration of 112 Gbps PAM4 traffic using Credo Semiconductors mixed signal SERDES with Samtec Flyover technology. First, Jignesh walks us through the signal path: Samtec High Density NovaRay Cable System A Credo Firebird SERDES generates 31-bit PRBS data at 112 Gbps PAM4 data rates.The signals travel … [Read more...]
A Connector Solution To Achieve 112 Gbps Data Rates
In the video above, Samtec's Jignesh Shah and Kevin Burt explain that as data rate requirements approach and surpass 112 Gbps PAM4, developers are challenged with balancing increasing throughput, scalability, and density demands with concerns such as power consumption, signal integrity, time-to-market, and of course cost. To hit these speeds, designers often have to use special board laminate materials with lower dielectric constants and dissipation factors. But the problem is, these … [Read more...]
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