Samtec is presenting new products and new technologies at Electronica 2018, as well as our full line of interconnects including High Speed Board-to-Board, High Speed Cable Assemblies, Micro/Rugged, Flexible Stacking, Optics and Precision RF. We are in a new location this year: we’re still in Hall B3, but we’re now at Stand 129, across from Molex. If […]
About Danny Boesing
New Catalog, New Products
Yeah, we know it’s the digital age, but we still print catalogs because a lot customers still ask for them. We print less than we used to, but they’re still available. Our new F-219 catalog was just released and it includes at least 34 new product series. Most are available and some are soon-be-released, but […]
Non Magnetic RF and Microwave Interconnects
Non Magnetic RF and Microwave Interconnects Samtec has a wide variety of non magnetic Microwave and RF interconnect devices. Dimensions and footprints of Samtec non magnetic interconnects are identical to standard products, enabling boards to be reused if device upgrades to true non magnetic are required, saving designers time and money. High-quality non magnetic RF […]
“Custom Connectors” For Stacking PCBs
Samtec offers one of the industry’s largest and most flexible lines of two-piece, pin-and-socket board-stacking interconnects. To say it another way, we have more ways to stack two or more boards together than any other connector company. Also, you can specify a custom stack height system using standard part numbers, and you have a ton of options if […]
EDI CON 2018: New Products, New Technologies
EDI CON USA brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, product demonstrations, training, and learning opportunities. And as you have probably already guessed, Samtec will be attending EDI CON. We will be presenting two workshops (more on this below), displaying and demonstrating our RF interconnect solutions, including our […]
Samtec Acquires Precision Connector, Inc (PCI)
Samtec Acquires PCI (Precision Connector, Inc.) Actually, we are announcing that we recently acquired the assets and going-forward business relationship of Precision Connector, Inc., or PCI. PCI specializes in design and manufacture of precision RF and microwave coaxial connectors and brings over 25 years of design experience in the RF/Microwave industry to the Samtec team. […]
Products, Technologies, Demos at OCP Europe
OCP Europe and Samtec OCP Europe is quickly becoming a leading technology event for the data center industry. As a leader in high-speed connectivity, Samtec will demonstrate multiple Silicon-to-Silicon system optimization architectures. Samtec application engineers and signal integrity experts will be on to provide details on these new system-level solutions. Two demonstrations will be front-and-center […]
100,000+ Connector ECAD Models Now Available on SnapEDA
Samtec is releasing new digital ECAD models for over 100,000 of its products on SnapEDA, the industry-leading circuit board design library. Traditionally, designers have spent days creating digital ECAD models – such as symbols and footprints – for each component in their designs. Creating ECAD connector models is especially time-consuming due to their non-standard shapes, […]
Innovative High Speed Solutions With One Up Studio
One Up Studio is a hardware design engineering provider with a focus on signal integrity, and not coincidentally, a Samtec customer. I caught up with Paul Monar, the owner, to pick his brain about some interesting design challenges he faces at One Up and his connector system selection criteria. DANNY: What type of customers use […]
Packaging Innovations For Medical Wearables
Steve Groothuis — or Groot to everybody else on this planet — Chief Technology Officer of Samtec Microelectronics, recently presented “Packaging Innovations For Medical Wearables” at the Medical Wearables Conference in Santa Clara, California. Groot’s presentation focused on the specific needs, challenges, and innovations within upcoming medical applications and medical device packaging. We caught up […]
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