The Hardware Pioneers Max exhibition is just a few weeks away. It started as a community meetup for engineers involved in the Internet of Things (IoT) and connected devices. Over the last decade, it has evolved into something much bigger. That evolution is reflected in this year’s move to ExCeL London. The event has grown…
RF and microwave (IMS), smart and connected devices (Hardware Pioneers), and the largest high-tech exhibition in Israel (New Tech) lead a busy month of Samtec conferences and exhibitions in June. Here’s the complete list. IMS June 9-11 | Boston | website Visit Samtec in booth #14036 to learn about our complete RF interconnect solutions, supporting…
Glass Core Technology (GCT) is Samtec’s ability to design and manufacture quick‑turn, extremely small, advanced glass interconnects that support millimeter wave frequencies through D‑band (170 GHz) and higher. To achieve this we leverage state-of-the-art, 100% in-house, semiconductor-style processing techniques including patterning circuits onto glass and formation of our patented through-glass vias (TGVs). This allows us…
High‑frequency test setups demand more than a connector that simply meets a frequency rating. Mechanical reliability, predictable and repeatable performance, and ease of use are essential, especially as designs become more challenging at 67 GHz and beyond. Samtec’s 1.85 mm 30‑degree angled launch compression mount connector (185-AL Series) is engineered with these real‑world requirements in mind. Now…
Anritsu and Samtec teamed up at DesignCon 2026 and demonstrated how Anritsu’s scalable, production-ready signal integrity test equipment can characterize large numbers of Samtec high-speed interconnect paths. In this brief video, Krishna Krishore (Anritsu) and Matt Burns (Samtec) review the products and processes in the live demonstration. Anritsu Scalable Signal Solution The demo showcased Anritsu’s…
Modern electronic systems are evolving at an extraordinary pace. Artificial intelligence, cloud computing, industrial automation, edge processing, and advanced embedded systems are all driving major increases in bandwidth, processing power, and overall system complexity. In this environment, industry standards have become more important than ever. Industry standards are no longer just compliance checklists. They provide…
At DesignCon 26, Samtec presented live demonstrations of new products and technologies. Two that received considerable attention were a 448 Gbps Co-Packaged Copper Channel and a 130 GHz Test Platform (224/448 Gbps-capable). In the video above, Samtec’s Andrew Josephson gives a brief overview of the 130 GHz solution. We see two versions of the new…
PCI-SIG Developers Conference May 6-7 | Santa Clara | website The PCI-SIG Developers Conferences is a free event for the 900+ member companies that develop and bring to market new products utilizing PCI Express® technology. It is an opportunity to learn directly from the industry’s PCIe® experts and participate in technical trainings to gain best…
I like fast cars. Each new car I buy seems to have more horsepower. More speed isn’t needed when driving to the grocery store, but it’s nice to have when passing the overburdened minivan in front of you. In a similar vein, the updated COM-HPC 1.3 specification from PICMG offers a pathway to increased throughput…
The latest episode of the Samtec Transmission Line podcast was released last week, and in it, we spoke with the irrepressible Ash from Samtec India. India is a vital market for the global electronics industry. As Ash put it, it’s not the next big opportunity. It is the opportunity. A vast, tech-savvy population combined with…
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