Most people in the electronics industry have a complicated relationship with trade shows. On one hand, they sound fabulously glamorous – the chance to visit a faraway town, connect with customers and show off your latest products. The reality is a little bit more mundane. Yes, it might be exotic to visit Paris, Munich or San Fransisco, but the truth is that you rarely see much beyond the taxi, the hotel or the convention centre. Trade shows mean early mornings, long days … [Read more...]
The Future of Content
The word “revolution” is very common in today’s world. Whether it’s a revolutionary new smartphone or a revolution in personal transport, it is a phrase that is used frequently. How many of these things are truly groundbreaking, or how many are victims of marketing is a matter of debate. Marketeers never lie, of course, but we have been known to squeeze the last ounce of truth from a story to make it appear more attractive! What cannot be denied is the staggering pace of … [Read more...]
A 112 Gbps High-Density Escape From The System ASIC To The Front Panel
In this video from EDI CON 2109, Samtec's Jignesh Shah explains how Samtec Flyover® offers a 112 Gbps high-density escape from the system ASIC to the front panel. This is a live demonstration of 112 Gbps PAM4 traffic using Credo Semiconductors mixed signal SERDES with Samtec Flyover technology. First, Jignesh walks us through the signal path: Samtec High Density NovaRay Cable System A Credo Firebird SERDES generates 31-bit PRBS data at 112 Gbps PAM4 data rates.The signals travel … [Read more...]
A Connector Solution To Achieve 112 Gbps Data Rates
In the video above, Samtec's Jignesh Shah and Kevin Burt explain that as data rate requirements approach and surpass 112 Gbps PAM4, developers are challenged with balancing increasing throughput, scalability, and density demands with concerns such as power consumption, signal integrity, time-to-market, and of course cost. To hit these speeds, designers often have to use special board laminate materials with lower dielectric constants and dissipation factors. But the problem is, these … [Read more...]
Samtec Technical Experts to Present at EDI CON ONLINE
"Where high frequency meets high speed," says the tag line of past EDI CON USA events. What exactly is EDI CON? Technical specialists from across the RF, microwave, EMC/EMI, high-speed digital design and system integrator spectrum met annually. Why? For networking, training and learning opportunities naturally. What about 2019? In a new twist, this event is going digital. EDI CON ONLINE replaces the in person events with virtual, real-time training. It has been specifically … [Read more...]
Severe Environment Testing for Connectors
With the advent of the Commercial Off-The-Shelf (COTS) part being used in Mil / Aero, Space, Industrial, Transportation, and Automotive applications; manufacturers find themselves still looking for information on how those products will perform in severe environments. Here at Samtec, we have recognized the need for more information about our COTS products, and that is why we have introduced Severe Environment Testing (SET). What is Severe Environment Testing? Severe Environment … [Read more...]
Samtec Expands VITA 57.4 with FMC+ Extender Card
Developing with FPGAs requires patience. Why? They are so flexible and configurable. System designers are only limited by their imagination. Prototyping with FPGAs also poses many challenges. It seems like there are new FMC / FMC+ solutions appearing daily. Sometimes the FPGA carrier card or development board can get crowded. How can that be fixed? VITA 57.4 FMC+ Extender Card Engineers prototyping with industry-standard FPGA evaluation and development kits often leverage the FMC+ … [Read more...]
Coming Soon: Extreme Performance, Micro Arrays
They say the early bird gets the worm. So, for all the early birds out there, here is a quick look at a new product not yet released, but coming soon - extreme performance micro arrays. AcceleRate® micro arrays (APM6/APF6) feature a flexible open-pin-field design with extreme performance to 56 Gbps NRZ/112 Gbps PAM4. This system is also data rate compatible with PCIe® Gen 5 speeds and 100 GbE. Not only are these arrays fast, but AcceleRate® is also cost optimized, which makes it ideal for … [Read more...]
Connector, Cable Systems For AI Hardware Design
In this video, Samtec's Ralph Page walks us through a live demonstration of a prototypical AI (artificial intelligence) hardware design. It shows PCB connectors and twinax cable systems with performance capabilities suitable for AI hardware applications. It’s a configurable, next-generation, possibly GPU-based system that combines a cable mesh backplane, a rigid-style backplane, high-speed edge card connectors, and precision RF interconnects. For example, this design could be based on … [Read more...]
New Intel FPGA Platform Features Samtec Interconnect
Transceivers. SerDes. XCVRs. Tx/Rx. Yada, Yada, Yada. FPGA designers want more of them. FPGA designers want them to be faster. Thankfully, the leading FPGA suppliers are answering the call. The Samtec blog features many solutions from Xilinx, but what about Intel? What options are they promoting? Intel® Agilex™ FPGA and SoCs Intel recently released their latest FPGA/SoC platform called Intel® Agilex™. This family leverages Intel's 10nm process technology and advanced architectures. … [Read more...]
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