Nokia Bell Labs (NBL) is leveraging Samtec glass core technology (GCT) as a platform for custom-designed silicon devices. NBL developed an electronics assembly on a glass package with multiple interconnect and chips to realize a full E-band radio on glass (RoG). To increase the reach of their E-band radio, they partnered with Northrop Grumman (NG),…
Glass Core Technology (GCT) was a hot topic at IMS 2026. One reason is that Samtec GCT has evolved into heterogeneous platforms, as detailed in the brief video from our friend Shahriar Shahramian. Glass is quickly becoming recognized as a viable and vital solution in the evolution of high-performance, high-frequency connectivity due to its material…
Anritsu and Samtec teamed up at DesignCon 2026 and demonstrated how Anritsu’s scalable, production-ready signal integrity test equipment can characterize large numbers of Samtec high-speed interconnect paths. In this brief video, Krishna Krishore (Anritsu) and Matt Burns (Samtec) review the products and processes in the live demonstration. Anritsu Scalable Signal Solution The demo showcased Anritsu’s…
At DesignCon 26, Samtec presented live demonstrations of new products and technologies. Two that received considerable attention were a 448 Gbps Co-Packaged Copper Channel and a 130 GHz Test Platform (224/448 Gbps-capable). In the video above, Samtec’s Andrew Josephson gives a brief overview of the 130 GHz solution. We see two versions of the new…
DesignCon 2026 once again showcased systems, equipment, and components capable of powering the next-generation bandwidth required for artificial intelligence, co-packaged optics, hyperscale data centers, routers, switches, and high-performance computing (HPC), among other applications. And once again, Samtec was front and center with a variety of live product demonstrations of 448, 224, and 112 Gbps PAM4….
This video shows a live product demonstration that’s a collaboration between Samtec and AMD. AMD’s Versal™ Premium VPK180 eval kit pushes 112G PAM4 performance at the full system level. Samtec interconnects are used throughout the system. Bassam Mansour, Sr. Technical Marketing Manager at AMD, and J.R. Bonnefoy, Systems Engineer at Samtec, walk us through the…
DesignCon 2026 placed strong emphasis on the influence that evolving AI infrastructure has on hardware design. The event underscored a transition from component-centric design to AI-driven system-level optimization for data centers, high-speed interconnects, test and measurement, and packaging. To that end, both Samtec and Keysight presented new products and technologies to address the next-generation bandwidth…
AI was the catalyst for many products and technologies demonstrated in exhibitor booths and discussed in technical reviews, tutorials, and presentations at DesignCon 2026. Samtec presented several live product demonstrations showcasing our 224 Gbps PAM4 interconnect solutions. These demonstrations incorporated our Si-Fly® HD cable solutions. Si-Fly HD CPX brings optics and copper together as a…
At DesignCon 2026, there was a lot of talk about 448 Gbps and how next-gen systems will achieve this data rate. One of the first steps in developing these new systems is to provide test and measurement data to designers. Samtec developed a prototype cable system representing a chip-to-chip, intra-tray GPU-to-GPU interconnect at 448 Gbps….
New years lead to new goals. As an technologist, I always need to stay on the bleeding edge. That’s require constant diligence, and it can be quite a challenge. Webinars always help. As the calendar flips into 2026 new products, industry standards, design techniques and more are coming down the pike. As always, engineers, technicians,…
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