DesignCon 2020 wrapped-up a few weeks ago. DesignCon, which celebrated its 25th anniversary in January, is an important conference/exhibition for Samtec. It’s an opportunity to present our new signal integrity optimized, high-performance interconnect and technology solutions. Here are a few key observations and takeaways from DesignCon 2020, from a connector manufacturer’s perspective: 112 Gbps Data Rates Several years ago DesignCon was abuzz with cutting edge 28 Gbps data rates. … [Read more...]
A 70 GHz High-Performance Test Solution
J.R. Bonnefoy, Systems Engineer at Samtec, walks us through a live product demonstration of a 70 GHz, high-performance test point system. This demo, from DesignCon 2020, incorporates two new high-performance products. The demo is based on Samtec’s 56 Gbps PAM4 Product Demonstration Platform. It emulates real-world 56 Gbps PAM4 design challenges which pairs bleeding edge silicon and interconnect solutions using real-world, optimized design practices. This demonstration focuses … [Read more...]
DesignCon 2020: A Technical Renaissance
Samtec loves DesignCon. It’s an opportunity to present our new signal integrity optimized, high-performance interconnect and technology solutions, along with the highest level of support and expertise in the industry. To learn more about these products and solutions, stop by the Samtec Booth, #737. I’m trying to be objective here, but if you’re in California the last week of January (or if you're in any of the other 50 states (or Canada or Mexico)), you need to stop by booth #737 at … [Read more...]
Full-Scale Immersion Cooling of Optical Transceiver, PCBs
While air cooling is still a commonly used method to cool data centers, the industry is seeing HPC, AI, and scientific computing market leaders investigating either conduction cooling, or full-scale immersion cooling, for their next generation designs. In this video from SuperComputing 2019, Arlon Martin and the Samtec Optical Group are demonstrating the latest developments in full-scale immersion cooling. Using Samtec Flyover® technology and FireFly™ optical modules as an … [Read more...]
Embedded Optical Development Platform For FMC+
This video from Super Computing 2019 (SC19) showcases a new embedded optical development platform and reference design. This new solution combines the latest FPGA solutions from REFLEX CES with the FireFly™ Micro Flyover System® from Samtec. Matt Burns, Technical Marketing Manager from Samtec, walks us through the demonstration. One part of this new platform is the Sargon Stratix® 10 FPGA FMC+ Instant Development Kit from REFLEX CES. The Sargon platform provides FPGA developers the … [Read more...]
Chassis-to-Chassis, Mid-Board Connectivity Via 5 Meter Cable Backplane
A popular demonstration at Super Computing 2019 (SC19) was a collaboration between Samtec and eSilicon that emulates next generation data center architectures for typical 19 inch rack-mount applications. In the video above, Ralph Page, Systems Architect at Samtec, walks us through this chassis-to-chassis demonstration that shows mid-board connectivity via a five meter cable backplane architecture. It utilizes Samtec Flyover® to extend signal reach and density to achieve these next gen … [Read more...]
56 Gbps PAM4 Connector Product Demonstration
In the video above Ralph Page, Systems Architect at Samtec, walks us through a live product demonstration that received a lot of attention at Super Computing 2019. Ralph discusses several Samtec 56 Gbps PAM4 connector solutions and shares some incredible results. The system can also run up to 28 Gbps NRZ. This is a fully-packaged system that populates signal paths using real-world signal integrity design practices. It demonstrates up to 56 Gbps PAM4 signaling, utilizing Samtec Flyover® … [Read more...]
How To Design An Edge Card Connector For Rugged Applications
Edge card connectors -- or are they card edge connectors? -- are a popular design option. That's because they make it easy to plug and unplug a mating card that may require more cycling than standard PCBs, and because the socket allows for relatively easy system upgrades and repairs, and there’s less cost with only one connector, and less processing time also. Interest and usage of micro pitch edge card connectors continues to grow. As with any micro-pitch interconnect, the stresses of … [Read more...]
A 112 Gbps High-Density Escape From The System ASIC To The Front Panel
In this video from EDI CON 2109, Samtec's Jignesh Shah explains how Samtec Flyover® offers a 112 Gbps high-density escape from the system ASIC to the front panel. This is a live demonstration of 112 Gbps PAM4 traffic using Credo Semiconductors mixed signal SERDES with Samtec Flyover technology. First, Jignesh walks us through the signal path: A Credo Firebird SERDES generates 31-bit PRBS data at 112 Gbps PAM4 data rates.The signals travel from the Credo test board, through precision … [Read more...]
A Connector Solution To Achieve 112 Gbps Data Rates
In the video above, Samtec's Jignesh Shah and Kevin Burt explain that as data rate requirements approach and surpass 112 Gbps PAM4, developers are challenged with balancing increasing throughput, scalability, and density demands with concerns such as power consumption, signal integrity, time-to-market, and of course cost. To hit these speeds, designers often have to use special board laminate materials with lower dielectric constants and dissipation factors. But the problem is, these … [Read more...]
- « Previous Page
- 1
- 2
- 3
- 4
- …
- 11
- Next Page »