At DesignCon 26, Samtec presented live demonstrations of new products and technologies. Two that received considerable attention were a 448 Gbps Co-Packaged Copper Channel and a 130 GHz Test Platform (224/448 Gbps-capable). In the video above, Samtec’s Andrew Josephson gives a brief overview of the 130 GHz solution. We see two versions of the new…
DesignCon 2026 once again showcased systems, equipment, and components capable of powering the next-generation bandwidth required for artificial intelligence, co-packaged optics, hyperscale data centers, routers, switches, and high-performance computing (HPC), among other applications. And once again, Samtec was front and center with a variety of live product demonstrations of 448, 224, and 112 Gbps PAM4….
DesignCon 2026 placed strong emphasis on the influence that evolving AI infrastructure has on hardware design. The event underscored a transition from component-centric design to AI-driven system-level optimization for data centers, high-speed interconnects, test and measurement, and packaging. To that end, both Samtec and Keysight presented new products and technologies to address the next-generation bandwidth…
AI was the catalyst for many products and technologies demonstrated in exhibitor booths and discussed in technical reviews, tutorials, and presentations at DesignCon 2026. Samtec presented several live product demonstrations showcasing our 224 Gbps PAM4 interconnect solutions. These demonstrations incorporated our Si-Fly® HD cable solutions. Si-Fly HD CPX brings optics and copper together as a…
At DesignCon 2026, there was a lot of talk about 448 Gbps and how next-gen systems will achieve this data rate. One of the first steps in developing these new systems is to provide test and measurement data to designers. Samtec developed a prototype cable system representing a chip-to-chip, intra-tray GPU-to-GPU interconnect at 448 Gbps….
Connect with Samtec experts at DesignCon 2026 to learn about new and established products and technologies that support data rates up to 448 Gbps and signals up to 130 GHz. As you work on your new designs, Samtec can help you find the optimal interconnect solution–whether it be copper or optics; connectors, cable systems, or…
Artificial Intelligence is advancing quickly, driving the development of a wide range of new hardware accelerators for Scale-up, Scale-out, High-Performance Computing, and more. Samtec collaborates closely with customers and partners to develop innovative interconnect solutions tailored to real-world AI acceleration topologies. The OCP Open Accelerator Infrastructure, or OCP OAI, is one example. Samtec has several solutions…
Besides its appeal to science fiction, humanoid robotics is an intriguing area in real world design that is growing at an impressive rate: The global humanoid robot market is projected to reach about $58.95 billion by 2031, with a compound annual growth rate (CAGR) of 50% [1]. The concept is not new. Many are aware…
We’re looking forward to SC25. SC25 is the international event for high-performance computing, networking, storage, and analysis. Samtec will present its full line of high-performance connectors for HPCs, including 224 Gbps PAM4 solutions, 112 Gbps mid-board optical transceivers, and PCIe 7.0 interconnect systems, among others. Here’s a quick recap of what you’ll see at the Samtec…
Samtec, Inc. and Molex announced a license agreement naming Molex as a second source for the Samtec Si-Fly® HD 224 Gbps PAM4 product family. Here is a link to Samtec’s press release: “Samtec Inks Second-Source License Agreement with Molex to Expand Reach of Si-Fly HD High-Speed Interconnects for Data Center and AI Applications.” The Samtec…
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