Signal Integrity expert Eric Bogatin recently shared three predictions on the state of signal integrity. Based on his discussions at DesignCon 2016 and thereafter, Eric has three predictions about major changes ahead for high speed serial link systems. The first is the rollout of 28 Gbps systems will be slower than expected. Eric explains that the semiconductor companies producing the CMOS devices – ASIC, FPGA or custom – are doing fine producing the silicon with acceptable performance at 28 … [Read more...]
Samtec to Present at Mentor Graphics Events
As a global leader in signal integrity, Samtec’s in-house engineering team utilizes EDA tools across the industry via our global 24/7 support of customer SI designs and applications. Our experience with these tools enables unique collaborations with EDA suppliers and industry leading technical events. Throughout spring and summer of 2016, we will be presenting our capabilities at technology events sponsored by Mentor Graphics. We invite you to stop by to learn more about … [Read more...]
28 Gbps Backplane Demo Using Virtex UltraScale FPGAs and Samtec Backplane System
Check out this Xilinx blog post about a 28 Gbps backplane demo using two Xilinx VCU 109 eval boards talking to each other over a Samtec backplane system. This was at the Teraspeed (Samtec) booth at DesignCon 2015. Nice video! … [Read more...]
“Causality De-Mystified” Is Best Paper Finalist At DesignCon 2015
Samtec’s paper “Causality De-Mystified” has been selected as a finalist for a Best Paper Award at DesignCon 2015. The papers are ranked in terms of Quality, Relevance, Impact, Originality and Commercial Content with the aggregate score determining the ranking. Papers with the highest ranking are selected for a Best Paper Award with the live presentation serving as the final award criteria. Awards for this year’s conference will be presented in January 2016 at DesignCon 2016. Causality is … [Read more...]
Papers, Product Demos, New Products At DesignCon 2015
Samtec, Inc., and Teraspeed® Consulting are presenting five technical papers, giving two physical high speed product demonstrations, and showcasing several new products at DesignCon 2015. Samtec’s new location is booth #943, and Teraspeed® Consulting is booth #1048. Samtec’s presentations are: Optimizing Symmetry in Open Pin Field Designs – Wednesday, January 28 – 2:50pm – 3:30pmCausality Demystified – Thursday, January 29 – 8:30am – 9:10am Teraspeed® Consulting’s presentations … [Read more...]
Julian Ferry Interview On High Speed Interconnect Design Developments
Julian Ferry, Samtec’s High Speed R&D Manager, recently spoke to Connector Supplier about the latest developments in high speed interconnects, the applications driving them, and how Samtec is meeting the challenges. Here is a full copy of the interview, courtesy of Connector Supplier. Q&A: Samtec on Signal Integrity. By Patricia Staino, June 16, 2014 Recently we spoke to Julian Ferry, high-speed R&D manager at Samtec, to learn more about the latest developments in high-speed … [Read more...]
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