DesignCon 2017 is right around the corner. As in past years, Samtec will have a large presence throughout the event. Our SI experts will present technical papers. Our application engineers will demonstrate new system-level solutions. Our product experts will discuss various new and emerging products that will be released throughout 2017. And if I'm there I'll be at the food court ... TECHNICAL PAPER Jim Nadolny, Samtec’s Director of Signal Integrity, will … [Read more...]
A New High Speed Connector Rating That Accounts For The Entire System
Designers periodically ask us for a "general bandwidth performance rating" to compare two or more interconnect systems. Of course numerous variables affect the signal integrity performance of an interconnect, so a one-size-fits-all approximation definitely does not fit all. Now, a new approach allows system signal integrity engineers to compare relative performance of connectors and cable assemblies while factoring in noise contributions from and interactions with other parts of the … [Read more...]
Samtec Releases “SI? Why do I Care” ChalkTalk
Samtec is pleased to announce a new ChalkTalk entitled “SI? Why do I Care?.” Hosted by EEJournal, this newly released ChalkTalk details SI basics and how they affect connector selection. SI not just for "Experts” Most designs these days have high-speed interfaces that require a solid strategy for SI. This calls for understanding the "basics" of SI. The ChalkTalk defines each of the following terms and how it relates to connector selection and simulation. Insertion Loss … [Read more...]
Best Practices For Connector Models
Eric Bogatin, Signal Integrity guru and friend of Samtec, recently posted a blog on “Best Practices For Connector Models.” He posted this on his Signal Integrity Journal website. Eric spoke with two of the worlds’ experts on high frequency electrical characterization of interconnects: Samtec’s own Jim Nadolny, our Principle SI Engineer, and Heidi Barnes, the ADS application engineering specialist with Keysight Technologies. Heidi and Jim cover a lot of topics, from S-parameter … [Read more...]
Solving Signal Integrity Problems At Very High Data Rates
Our friends at EDN recently published Solving Signal Integrity Problems At Very High Data Rates. The article - written by Lee Ritchey and Kella Knack from Speeding Edge and Teraspeed's own Scott McMorrow - discusses the challenges of achieving high data rates given parasitics in PCBs. It presents a novel, alternative design approach to the problem. To elaborate a bit ... Advances in semiconductor technology are making it possible to connect components in … [Read more...]
Samtec Mentor Graphics PCB Forum Courses Now Online
As a global leader in signal integrity, Samtec’s in-house engineering team utilizes EDA tools across the industry via our global 24/7 support of customer SI designs and applications. Our experience with these tools enables unique collaborations with EDA suppliers and industry leading technical events. At the recent Mentor Graphics PCB Forums, signal integrity experts from Teraspeed® Consulting, a division of Samtec, provided SI/PI design know-how, tips and tricks … [Read more...]
Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules (Part 2)
Steve Groothuis, CTO of Samtec Microlectronics, recently conducted a workshop at the Autonomous Vehicles 2016 Conference and Workshop. Steve’s presentation is “Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules.” This is second installment in a two-part article with a video of the conclusion of Steve's workshop presentation. Here is the link to the first blog, with the first half of the video. With autonomous vehicles currently being … [Read more...]
Samtec Expands Channelyzer™ to Support Backplane Applications
Samtec continues to expand its capabilities in support of backplane connector applications. In addition to our recent announcement with Amphenol, we continue to augment the ecosystem of support required for these high-speed, high-performance products. When we announced the initial release of Channelyzer™ - Samtec's Online Full Channel Simulation and Analysis tool - earlier this year, the tool initially supported only high-speed board-to-board applications. We … [Read more...]
Samtec Launches Silicon-to-Silicon™ System Optimization Microsite
Increasing data rates, denser systems and shrinking product footprints challenge designers to meet their system signal integrity needs. Samtec’s Silicon-to-Silicon™ System Optimization capabilities provide engineers the service, products, tools and resources to optimize the entire signal chain of a system, from bare die to IC package and assembly, to PCB, to connectors and cable assemblies, and back again. Gaining access to all of these capabilities can be daunting for those not familiar … [Read more...]
Xilinx and Samtec Deepen Technical Collaboration
Higher data rates in today’s bleeding edge ICs require constant innovation in interconnect to route signals on PCBS and between them. Samtec’s Silicon to Silicon System Optimization provides engineers the service, products, tools and resources to optimize the entire signal path from bare die to IC package and assembly to PCB to connectors and cable assemblies and back again. A practical case study in our Silicon to Silicon System Optimization capabilities is leading FPGA vendor Xilinx. … [Read more...]