Steve Groothuis, CTO of Samtec Microlectronics, recently conducted a workshop at the Autonomous Vehicles 2016 Conference and Workshop. Steve’s presentation is “Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules.” This is second installment in a two-part article with a video of the conclusion of Steve’s workshop presentation. Here is the link to the first blog, with the first half of the video.
With autonomous vehicles currently being developed and prototyped, the requirements of miniaturization, higher functionality, size/weight, and high reliability cannot be compromised. In this workshop Steve focuses on electrical, mechanical, and electro-optical aspects that define autonomous vehicles’ electronic products success.
Key takeaways include:
- Semiconductors and their package integration are sources of automotive innovation.
- Automotive innovation needs the newest technologies.
- Combined sensing and imaging systems will provide a more comprehensive solution (e.g., LiDAR and CMOS camera).
- Redundancy (several 360° sensors) are required to ensure fail-safe autonomous action.
- Each phase of Autonomous Vehicle innovation imposes different challenges on semiconductors, packaging, and integration.
- System-, module-, package-, and device-level integration are future ADAS challenges.
- Complete supply chain has to cooperate at a different level to make tomorrow’s automotive applications reliable and fail safe.
If you have questions for Steve, you can contact him at this address.
Other links that may be of interest:
- Samtec Microelectronics
- Automotive Solutions Guide
- Samtec Automotive Special Standards – ACD Series / TS-16949 (please scroll down to “Automotive.”)
- Automotive Solutions Catalog
