5G and advanced digital computing technologies require ultra-high-speed interconnects with minimal signal degradation. As mmWave/RF circuits look to extend to 170GHz and beyond, many are exploring new materials to use as a substrate and/or an interposer. Applications such as medical (especially implantable devices), datacom, and aerospace, require high-performance, high-reliability, and precision in small footprints. Glass…
“I’m lovin’ it.” “Can you hear me now?” “Just do it.” “Where High Frequency Meets High Speed” The first three taglines are a part of pop culture lexicon. The last describes an annual technology event – EDICON Online 2022 – focused on training and informing engineers on that latest high-performance technologies, solutions, trends and design…
In this product demonstration from Design 2020, Keith Guetig, High-Speed Product Manager at Samtec, explains how Samtec Direct Connect™ technology enables 56 Gbps PAM4 and 112 Gbps PAM4 systems. 5G, high performance computing, emulation, AI and machine learning technology segments all benefit from bleeding edge speed and reach, especially at 56 and 112G PAM4. Direct…
Samtec’s Brian Niehoff presented “Biomedical Solutions: Integrating New Chips, Packages, and Modules” at the recent BIOMEDevice conference and exhibition in Boston. To give a super-quick synopsis, Brian explains how microelectronics are incorporated into medical devices and diagnostic equipment. Since he’s a Samtec guy, he also elaborates on Samtec Glass Core Technology (GCT), a proprietary process…
In the days of old we looked into the “green” for guidance on how much further down into the world of miniaturization we could go. What is the green you ask? I am talking about the substrate that has served us all well for many years; the PCB. We are at a crossroads in the…
Advances in packaging have afforded companies the ability to place a larger number of contacts in smaller footprints, improve the thermal characteristics, and improve the electrical performance of their systems. One of these advances comes in the form of Fan-Out Wafer-Level Packaging (FOWLP). FOWLP offers an improvement over wafer-level packaging (WLP), and was developed to…
If you aren’t from the packaging world, then chances are likely you might think “packing” refers to objects being placed in to a box instead of packaging integrated circuits (IC’s) on a substrate. Packaging has advanced since it began, and as with many areas it is all in effort to save space, obtain faster speeds,…
Steve Groothuis — or Groot to everybody else on this planet — Chief Technology Officer of Samtec Microelectronics, recently presented “Packaging Innovations For Medical Wearables” at the Medical Wearables Conference in Santa Clara, California. Groot’s presentation focused on the specific needs, challenges, and innovations within upcoming medical applications and medical device packaging. We caught up…
There is a never-ending trail of newsworthy autonomous driving items. Silicon Valley makes headlines with the latest discovery. Some new self-driving start-up gets VC backing in San Francisco, Boston or Pittsburgh. The Detroit Big 3 continue to make strategic investments as the market for cars continues to evolve. As autonomous driving becomes mainstream, new sensing…
One of the largest events in the embedded electronics industry – Embedded World 2018 – occurs from Nuremberg this week. More than 1,000 exhibitors, including Samtec, will showcase new products and innovations across the spectrum of the embedded applications. Samtec will exhibit its growing technical breadth at Embedded World 2018 in Hall 4A, Stand 4A-240. New…
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