"I'm lovin' it." "Can you hear me now?" "Just do it." "Where High Frequency Meets High Speed" The first three taglines are a part of pop culture lexicon. The last describes an annual technology event - EDICON Online 2022 - focused on training and informing engineers on that latest high-performance technologies, solutions, trends and design techniques. The world of high-frequency and high-speed is converging as never before. Real-world and modeled 224 Gbps PAMx system design … [Read more...]
Direct Connect To The Silicon Package
In this product demonstration from Design 2020, Keith Guetig, High-Speed Product Manager at Samtec, explains how Samtec Direct Connect™ technology enables 56 Gbps PAM4 and 112 Gbps PAM4 systems. 5G, high performance computing, emulation, AI and machine learning technology segments all benefit from bleeding edge speed and reach, especially at 56 and 112G PAM4. Direct Connect With Direct Connect, Samtec Flyover® cable assemblies plug directly into the chip package. This is an enabler for … [Read more...]
Let’s Get Small: Microelectronics In Biomedical Devices
Samtec’s Brian Niehoff presented “Biomedical Solutions: Integrating New Chips, Packages, and Modules” at the recent BIOMEDevice conference and exhibition in Boston. To give a super-quick synopsis, Brian explains how microelectronics are incorporated into medical devices and diagnostic equipment. Since he’s a Samtec guy, he also elaborates on Samtec Glass Core Technology (GCT), a proprietary process that leverages the performance benefits of glass, and how it can be also be used in … [Read more...]
Glass; Not Your Mom’s Substrate.
In the days of old we looked into the "green" for guidance on how much further down into the world of miniaturization we could go. What is the green you ask? I am talking about the substrate that has served us all well for many years; the PCB. We are at a crossroads in the world of substrates, and honestly we are at a point where we need something new, a different way of addressing miniaturization and higher speeds. What are my options? The printed circuit board has come a long way from … [Read more...]
Fan-Out Wafer-Level Packaging
Advances in packaging have afforded companies the ability to place a larger number of contacts in smaller footprints, improve the thermal characteristics, and improve the electrical performance of their systems. One of these advances comes in the form of Fan-Out Wafer-Level Packaging (FOWLP). FOWLP offers an improvement over wafer-level packaging (WLP), and was developed to provide a greater number of external contacts with a silicon die. How does it work? The … [Read more...]
Integrated Circuit Packaging and GCT
If you aren’t from the packaging world, then chances are likely you might think “packing” refers to objects being placed in to a box instead of packaging integrated circuits (IC’s) on a substrate. Packaging has advanced since it began, and as with many areas it is all in effort to save space, obtain faster speeds, and to lower costs. Without advances in packaging, we can’t get smaller phones, medical implantables and wearables, or even smaller sensors on an autonomous car. 2D, 2.5D, and 3D … [Read more...]
Packaging Innovations For Medical Wearables
Steve Groothuis -- or Groot to everybody else on this planet -- Chief Technology Officer of Samtec Microelectronics, recently presented “Packaging Innovations For Medical Wearables” at the Medical Wearables Conference in Santa Clara, California. Groot’s presentation focused on the specific needs, challenges, and innovations within upcoming medical applications and medical device packaging. We caught up with Groot and asked him about the presentation and its message. DANNY: Steve, … [Read more...]
Samtec Supports LIDAR and Radar in Autonomous Vehicles
There is a never-ending trail of newsworthy autonomous driving items. Silicon Valley makes headlines with the latest discovery. Some new self-driving start-up gets VC backing in San Francisco, Boston or Pittsburgh. The Detroit Big 3 continue to make strategic investments as the market for cars continues to evolve. As autonomous driving becomes mainstream, new sensing elements and high-precision imaging systems enable vehicles to continuously monitor and recognize their surrounding … [Read more...]
Samtec Exhibits Technical Breadth at Embedded World 2018
One of the largest events in the embedded electronics industry - Embedded World 2018 - occurs from Nuremberg this week. More than 1,000 exhibitors, including Samtec, will showcase new products and innovations across the spectrum of the embedded applications. Samtec will exhibit its growing technical breadth at Embedded World 2018 in Hall 4A, Stand 4A-240. New high-speed board-to-board connectors ideally suited for embedded systems will be highlighted. Samtec's microelectronic … [Read more...]
Samtec Releases New Product Overview Guide
Who doesn’t like something new? Maybe it’s that new smell, a new flavor, or a new feature that draws you in each and every time. Well, we love new things around here and are excited to share the new Product Overview Guide. It might not smell or taste new, but it is packed with new technologies and our entire product line that supports full system signal integrity from Silicon-to-Silicon. New, standard and custom products are categorized in six solution blocks designed to support any … [Read more...]