Who doesn’t like something new? Maybe it’s that new smell, a new flavor, or a new feature that draws you in each and every time. Well, we love new things around here and are excited to share the new Product Overview Guide. It might not smell or taste new, but it is packed with new…
The Samtec Microelectronics Group’s (SME) advanced packaging and high-speed interconnect expertise enable us to provide support for the performance, integration and miniaturization demands of next gen applications, including Connectivity, MedTech, MEMS & Sensors, and Optics, Imaging & Photonics. Our advanced package design and glass core technology capabilities, along with standard design guidelines, are detailed in…
In this short video, Steve Groothuis, Chief Technology Officer for Samtec Microelectronics, explains Glass Core Technology (GCT), why it matters in advanced substrate packaging, and the solutions it provides. GCT is a proprietary process that leverages the performance benefits of glass by creating small diameter, fine pitch Through-Glass Vias that are metalized and hermetically sealed….
Samtec will be attending ECTC 2017 from May 30 to June 2 at Booth 313/315. We will be featuring several IC packaging solutions such as flip chip, ultra high density micro interposers, as well as offering full system support. In addition, we will also be showcasing our glass core technology (GCT). ECTC The Electronic Components and…
Steve “Groot” Groothuis, CTO of Samtec Microelectronics, recently presented “Biomedical Solutions: Successfully Integrating New Chips, Packages, and Modules” at BIOMEDevice in Boston. The presentation included an overview of: How Samtec microelectronics are incorporated into medical devices and diagnostic equipment Glass Core Technology (GCT), a proprietary process that leverages the performance benefits of glass by creating small…
Samtec released Silicon-to-Silicon™ System Optimization Microsite in early 2016. This one-stop shop summarizes all of Samtec’s Silicon-to-Silicon™ System Optimization capabilities. It provides engineers the service, products, tools and resources to optimize the entire signal chain of a system, from bare die to IC package and assembly, to PCB, connectors and cable assemblies, and back again. The…
DesignCon 2017 is next week in San Jose, California. If you’re going to be there, here are 7 reasons to visit us at booth 717. They’re all good reasons, and #5 is really cool, but it may not actually blow your mind. Sorry. Like me, you’ve probably seen the “sponsored articles” at the bottom of…
Data rates continue to increase unfettered. While the ubiquitous demand for more bandwidth seems to have no end, silicon as a semiconductor has practical limitations in the data rates it can support. One possible solution for this challenge is silicon photonics. The technology uses silicon as a laser for data transmission between ICs, but leverages the existing semiconductor…
IMAPS – International Microelectronics Assembly and Packaging Society – in one of the biggest events of the year in the IC Package and Assembly industry. Last week at IMAPS 2016, Samtec Microelectronics highlighted our world-class complex package and assembly capabilities and our emerging Glass Core Technology (GCT). Samtec’s IC package and assembly capabilities include precision die attach, ultra-fine…
Steve Groothuis, CTO of Samtec Microlectronics, recently conducted a workshop at the Autonomous Vehicles 2016 Conference and Workshop. Steve’s presentation is “Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules.” This is second installment in a two-part article with a video of the conclusion of Steve’s workshop presentation. Here is the link to the first blog, with…
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