Samtec released Silicon-to-Silicon™ System Optimization Microsite in early 2016. This one-stop shop summarizes all of Samtec’s Silicon-to-Silicon™ System Optimization capabilities.
It provides engineers the service, products, tools and resources to optimize the entire signal chain of a system, from bare die to IC package and assembly, to PCB, connectors and cable assemblies, and back again.
The updated and streamlined Silicon-to-Silicon™ System Optimization web experience is now easily navigable from the Samtec homepage. Engineers and designers will no longer have to browse to a separate location as with the previous version of the microsite.
There are several new sections making it easier for engineers and designers to find the information they need for shorter design cycles and quicker time to market.
Signal Integrity for Silicon-to-Silicon
Silicon-to-Silicon™ System Optimization capabilities assist designers in optimizing the high-speed serial path from bare die, to IC package and assembly, to PCB, connectors and cable assemblies, and back again.
Key areas of focus include:
- IC Packaging and Assembly
- Mid-Board and Panel Optics
- Twinax Flyover
- High-Speed Mezzanine
- High-Speed Backplane
Samtec Technology Centers are dedicated to developing and advancing technologies, strategies, and products to optimize both the performance and cost of a system.
These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization – from Silicon-to-Silicon™.
Samtec’s Technology Centers include:
- Signal Integrity Group
- High-Speed Cable Plant
- Samtec Microelectronics Group
- Samtec Optical Group
- Advanced Interconnect Design
- Teraspeed® Consulting
Samtec technology leaders – product designers, signal integrity experts, product managers, applications engineering, technical marketing and others – share their expertise in a variety of resources, including blogs, papers, articles, videos, and presentations.
Engineers can sort these resources via the following topics:
- IC Packaging
- Signal Integrity
For more information on these and related topics, please download the Samtec Silicon-to-Silicon™ Optimization Guide.