IMAPS – International Microelectronics Assembly and Packaging Society – in one of the biggest events of the year in the IC Package and Assembly industry. Last week at IMAPS 2016, Samtec Microelectronics highlighted our world-class complex package and assembly capabilities and our emerging Glass Core Technology (GCT).
Samtec’s IC package and assembly capabilities include precision die attach, ultra-fine pitch wire bonding, expertise in packaging and substrate design, stacked die, multi-chip modules, interposer integration, ceramics and organics.
These core capabilities were demonstrated at IMAPS as shown on the right.
For more detail on our core Advanced IC Packaging capabilities, download any of the following Design Guidelines:
- Flip Chip Design Guidelines
- Die Attach Design Guidelines
- Wirebond Design Guidelines
- Package Encapsulation Design Guidelines
The highlight of our IMAPS demonstration was our emerging glass core technology. GCT is a proprietary process that leverages the performance benefits of glass by creating small diameter, fine pitch Through-Glass Vias (TGVs) that are metalized and hermetically sealed.
The TGVs are linked via a unique thin film Redistribution Layer (RDL) process to create custom circuits on a glass substrate.
GCT allows for IC packaging solutions with faster cycle times and KGD testing at higher packaging integration levels, at the lowest cost in the marketplace.
The challenges of generating small diameter TGVs with fine pitches are eliminated with Samtec’s proprietary GCT process. Samtec offers three types of TGVs: tapered, hourglass and straight. TGV type is dependent upon both industry and application requirements.
Samtec’s RDL technology is a unique, thin-film approach to interfacing with the TGVs. This technique enables circuit formation on glass substrates which provides a low loss, fan-out of chip and package interconnects at a lower cost than silicon interposers.
For more information on Samtec’s new Glass Core Technology, download the following resources:
Contact the Samtec Microelectronics experts for any additional support you may need.