“I’m lovin’ it.”
“Can you hear me now?”
“Just do it.”
“Where High Frequency Meets High Speed”
The first three taglines are a part of pop culture lexicon. The last describes an annual technology event – EDICON Online 2022 – focused on training and informing engineers on that latest high-performance technologies, solutions, trends and design techniques.
The world of high-frequency and high-speed is converging as never before. Real-world and modeled 224 Gbps PAMx system design requires high-frequency expertise from 28 -112 GHz. The signal chain includes individual discrete circuits, die, substrates, packaging, PCB termination, signal breakouts, via placements, PCB traces, copper cable assemblies, optical transceivers and more.
EDICON Online 2022 offers RF, Microwave, SI, PI, and EMC/EMI engineers, designers and technicians access to industry luminaries and technology specialists in a variety of training formats. Each Wednesday in October features:
- Technical Sessions
- Featured Talks
As a EDICON Online 2022 Platinum and Workshop Sponsor, two Samtec technology experts will present at the event? Which topics and technical trends will they cover?
Cascaded or End-to-End Interconnect Models: What Do We Give Up?
Robert Branson is Samtec’s first presenter at EDICON Online 2022. He currently works as a SI engineer while completing his masters in EE. His experience includes design work on connectors and boards, correlation of designed connectors, and research into improvements to the high-end connector design process. He works mainly with connectors in the 56 – 112 Gbps range using the ANSYS design suite.
Reduced channel simulation times can be achieved by simulating PCBs and connectors separately then via cascading. However, this approach introduces impedance and crosstalk inaccuracies.
This presentation demonstrates the differences through correlated simulation and measurement models. It then uses fields plots to devise mitigation strategies to maintain the increased simulation time while avoiding simulation inaccuracy.
A Comprehensive Method for the Design of BGA Connector and via Breakouts for Layout
Samtec’s other technical presenter at EDICON Online 2022 is Strategic Technologist Scott McMorrow. As a consultant for years too numerous to mention, Scott has helped many companies develop high-performance products, while training SI engineers. Today he works for “the man,” where he continues being a problem solver, a change agent and “betting his job” every day.
In designing via breakouts for BGAs, connectors and freestanding via transitions, engineers may box themselves into a corner where layout is exceedingly difficult. Designers may also fall into the “mole hole” of endless optimization simulations that seem more like a game of “Whack-a-Mole” than a design methodology.
This presentation will provide a simplified process that is guaranteed to converge application-specific solutions to make the design “work”. Knowledge of general PCB design rules, 3D EM solvers, and full signal channel analysis is assumed.
Robert, Scott and the whole Samtec team cordially invite you register and attend EDICON Online 2022.
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