One of the largest events in the embedded electronics industry – Embedded World 2018 – occurs from Nuremberg this week. More than 1,000 exhibitors, including Samtec, will showcase new products and innovations across the spectrum of the embedded applications.
Samtec will exhibit its growing technical breadth at Embedded World 2018 in Hall 4A, Stand 4A-240. New high-speed board-to-board connectors ideally suited for embedded systems will be highlighted.
Samtec’s microelectronic experts are available to discuss the latest advances in IC packaging and assembly and new Glass Core Technology. Samtec will also display embedded computing platforms using Samtec interconnect solutions.
New High-Speed Board-to-Board Connectors
Samtec’s new 0.80 mm pitch differential pair edge card connectors create solutions for higher speed applications and misalignment concerns. The HSEC8-DP Series is a differential pair version of Samtec’s popular Edge Rate® 0.80 mm pitch sockets.
Rated for speeds of 28 Gbps NRZ/56 Gbps PAM4, the socket features Edge Rate® contacts designed to increase cycle life and decrease crosstalk.
A low-profile object is defined as lower or slimmer than what is typical. Samtec’s new low-profile edge card connector (PCIE-LP Series) is PCI Express® Gen 4 compliant and supports one, four, eight and sixteen links for different bandwidth requirements. It also features Edge Rate® contacts on a 1.00 mm (.0394”) pitch for optimized SI performance.
Samtec’s SEARAY™ product family is already the industry’s largest offering of high-speed, high-density, open-pin-field arrays, but there’s always room for more at the table. The new 7.5 mm body height SEAF socket supports several new mated stack heights: 10.5 mm, 11 mm, 14.5 mm, 16.5 mm and 18.5 mm.
Samtec Microelectronics Featured at Embedded World
Next-generation 56+ Gbps integrated circuits require robust signal integrity, optimized power integrity, compact packages and advanced assembly techniques. Samtec’s team of technical experts, including packaging and assembly designers, Signal Integrity / Power Integrity engineers, material scientists and system architects, collaborate to identify the ideal solution for any application.
Glass substrates offer high structural integrity, resistance to vibration and temperature, environmental ruggedness, and low electrical loss, making them ideal for next-generation microelectronics demands.
Samtec’s proprietary Glass Core Technology process leverages the performance benefits of glass to enable performance optimized, ultra-miniaturized substrates for next-generation designs.
Embedded Computing Modules
Samtec is a leader in developing standards-based interconnect solutions. As a member of VITA, Samtec has helped to develop specifications and standards important to designers of critical embedded systems around the world including VITA 42 XMC, VITA 57 FMC/FMC+ and VITA 74 VNX.
Samtec has partnered with several industry-leading embedded computing suppliers at Embedded World 2018. The Samtec booth highlights the breadth of solutions available both in standard and custom form-factors leveraging Samtec’s Standards solutions.
The XPredite7501 XMC Module from Extreme Engineering Solutions utilizes Intel’s® 5th generation i7 Broadwell-H processor to provide high performance with low power consumption. The XPedite7501 ideally supports high-bandwidth data processing applications. It leverages a SAMARRAY® connector for I/O expansion.
Samtec’s VITA 57.4 FMC+ HSPC/HSPCe Loopback Card provides an easy to use loopback option for testing low and high-speed multi-gigabit transceivers on any FPGA development board or carrier card and, is an ideal substitute for 28 Gbps test equipment.
The Trident Infosol Raptoris a rugged, small form factor, COTS pre-qualified computer based on VITA 74 VNX standard. This new solution has been specifically designed for significantly smaller deployments. The Raptor features Samtec’s 12.5mm and 19mm SEARAY-RA™ connectors adopted in VITA 74 VNX.
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