Best Practices For Connector Models

ByDanny Boesing Design for SI, Silicon-to-Silicon, Technical
model-samtec

Eric Bogatin, Signal Integrity guru and friend of Samtec, recently posted a blog on “Best Practices For Connector Models.”  He posted this on his Signal Integrity Journal website.

Eric spoke with two of the worlds’ experts on high frequency electrical characterization of interconnects:  Samtec’s own Jim Nadolny, our Principle SI Engineer, and Heidi Barnes, the ADS application engineering specialist with Keysight Technologies.

Heidi and Jim cover a lot of topics, from S-parameter behavior models, to paying attention to details of material properties, return path, PCB stack-up, and break out region (BOR) of the PCB, to name a few.

Eric’s blog is a relatively quick read, and always worthwhile.

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Danny Boesing likes electronics and Marketing, also loves his family and the outdoors. He's a Product Marketing Director at Samtec.