Eric Bogatin, Signal Integrity guru and friend of Samtec, recently posted a blog on “Best Practices For Connector Models.” He posted this on his Signal Integrity Journal website.
Eric spoke with two of the worlds’ experts on high frequency electrical characterization of interconnects: Samtec’s own Jim Nadolny, our Principle SI Engineer, and Heidi Barnes, the ADS application engineering specialist with Keysight Technologies.
Heidi and Jim cover a lot of topics, from S-parameter behavior models, to paying attention to details of material properties, return path, PCB stack-up, and break out region (BOR) of the PCB, to name a few.
Eric’s blog is a relatively quick read, and always worthwhile.
Other links that may be of interest:
- Best Practices For Connector Models
- Be The Signal
- Signal Integrity Journal
- Eric Bogatin
- Samtec Signal Integrity Group
- Connector Selection Discussion For SI Interconnects
- High-Speed Board-to-Board Interconnects
- High-Speed Cable Assemblies
- 3D Models In Under A Minute, No Login Required
- Mechanical or Digital Samples? We Got ‘Em Both!