As a global leader in signal integrity, Samtec’s in-house engineering team utilizes EDA tools across the industry via our global 24/7 support of customer SI designs and applications. Our experience with these tools enables unique collaborations with EDA suppliers and industry leading technical events. At the recent Mentor Graphics PCB Forums, signal integrity experts from Teraspeed® Consulting, a division of Samtec, provided SI/PI design know-how, tips and tricks … [Read more...]
Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules (Part 2)
Steve Groothuis, CTO of Samtec Microlectronics, recently conducted a workshop at the Autonomous Vehicles 2016 Conference and Workshop. Steve’s presentation is “Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules.” This is second installment in a two-part article with a video of the conclusion of Steve's workshop presentation. Here is the link to the first blog, with the first half of the video. With autonomous vehicles currently being … [Read more...]
Samtec Expands Channelyzer™ to Support Backplane Applications
Samtec continues to expand its capabilities in support of backplane connector applications. In addition to our recent announcement with Amphenol, we continue to augment the ecosystem of support required for these high-speed, high-performance products. When we announced the initial release of Channelyzer™ - Samtec's Online Full Channel Simulation and Analysis tool - earlier this year, the tool initially supported only high-speed board-to-board applications. We … [Read more...]
Samtec Launches Silicon-to-Silicon™ System Optimization Microsite
Increasing data rates, denser systems and shrinking product footprints challenge designers to meet their system signal integrity needs. Samtec’s Silicon-to-Silicon™ System Optimization capabilities provide engineers the service, products, tools and resources to optimize the entire signal chain of a system, from bare die to IC package and assembly, to PCB, to connectors and cable assemblies, and back again. Gaining access to all of these capabilities can be daunting for those not familiar … [Read more...]
Xilinx and Samtec Deepen Technical Collaboration
Higher data rates in today’s bleeding edge ICs require constant innovation in interconnect to route signals on PCBS and between them. Samtec’s Silicon to Silicon System Optimization provides engineers the service, products, tools and resources to optimize the entire signal path from bare die to IC package and assembly to PCB to connectors and cable assemblies and back again. A practical case study in our Silicon to Silicon System Optimization capabilities is leading FPGA vendor Xilinx. … [Read more...]
Eric Bogatin’s Three Predictions On The State Of Signal Integrity
Signal Integrity expert Eric Bogatin recently shared three predictions on the state of signal integrity. Based on his discussions at DesignCon 2016 and thereafter, Eric has three predictions about major changes ahead for high speed serial link systems. The first is the rollout of 28 Gbps systems will be slower than expected. Eric explains that the semiconductor companies producing the CMOS devices – ASIC, FPGA or custom – are doing fine producing the silicon with acceptable performance at 28 … [Read more...]
Samtec to Present at Mentor Graphics Events
As a global leader in signal integrity, Samtec’s in-house engineering team utilizes EDA tools across the industry via our global 24/7 support of customer SI designs and applications. Our experience with these tools enables unique collaborations with EDA suppliers and industry leading technical events. Throughout spring and summer of 2016, we will be presenting our capabilities at technology events sponsored by Mentor Graphics. We invite you to stop by to learn more about … [Read more...]
28 Gbps Backplane Demo Using Virtex UltraScale FPGAs and Samtec Backplane System
Check out this Xilinx blog post about a 28 Gbps backplane demo using two Xilinx VCU 109 eval boards talking to each other over a Samtec backplane system. This was at the Teraspeed (Samtec) booth at DesignCon 2015. Nice video! … [Read more...]
“Causality De-Mystified” Is Best Paper Finalist At DesignCon 2015
Samtec’s paper “Causality De-Mystified” has been selected as a finalist for a Best Paper Award at DesignCon 2015. The papers are ranked in terms of Quality, Relevance, Impact, Originality and Commercial Content with the aggregate score determining the ranking. Papers with the highest ranking are selected for a Best Paper Award with the live presentation serving as the final award criteria. Awards for this year’s conference will be presented in January 2016 at DesignCon 2016. Causality is … [Read more...]
Papers, Product Demos, New Products At DesignCon 2015
Samtec, Inc., and Teraspeed® Consulting are presenting five technical papers, giving two physical high speed product demonstrations, and showcasing several new products at DesignCon 2015. Samtec’s new location is booth #943, and Teraspeed® Consulting is booth #1048. Samtec’s presentations are: Optimizing Symmetry in Open Pin Field Designs – Wednesday, January 28 – 2:50pm – 3:30pmCausality Demystified – Thursday, January 29 – 8:30am – 9:10am Teraspeed® Consulting’s presentations … [Read more...]