Glass Weave Skew. For most people it probably sounds like a progressive rock band. But we're talking about Glass Weave Skew and differential signals. Brandon Gore, Senior Staff Signal Integrity Engineer, and the Manager of Samtec's Signal Integrity Group, R&D Hub recently presented "A Vehicle For Insitu Glass Fabric Characterization" at EDI CON USA 2017. The research was completed by Brandon and supported by Scott McMorrow, Samtec’s CTO of Signal Integrity Products. In his … [Read more...]
Samtec Releases New Product Overview Guide
Who doesn’t like something new? Maybe it’s that new smell, a new flavor, or a new feature that draws you in each and every time. Well, we love new things around here and are excited to share the new Product Overview Guide. It might not smell or taste new, but it is packed with new technologies and our entire product line that supports full system signal integrity from Silicon-to-Silicon. New, standard and custom products are categorized in six solution blocks designed to support any … [Read more...]
Microelectronics Group Provides Support For Advanced Microelectronics Applications
The Samtec Microelectronics Group's (SME) advanced packaging and high-speed interconnect expertise enable us to provide support for the performance, integration and miniaturization demands of next gen applications, including Connectivity, MedTech, MEMS & Sensors, and Optics, Imaging & Photonics. Our advanced package design and glass core technology capabilities, along with standard design guidelines, are detailed in the new Microelectronics Interconnect Solutions … [Read more...]
Samtec to Present at Mentor User2User 2017 PADS Events
Designing PCBs used to be easy. Typically PCBs only had a few components. They usually only had one or two layers. Data rates were a few Kbps or Mbps. Like The Right Stuff, Richard Dean Anderson's MacGyver and Tang, these are concepts only understood by engineers of a certain era. What about today? PCB Designers and Layout Engineers face a growing number of design challenges. Data rates seem to get faster by the day. PCB design teams span the globe. … [Read more...]
Real World 28 Gbps Connector Demonstration
The 28 Gbps Product Demonstrator is an active system that showcases Samtec interconnect products at 28 Gbps and beyond. In this brief video overview, Scott McMorrow, Samtec's CTO of Signal Integrity Products, and Brian Vicich, VP of Engineering, explain that it was designed to showcase Samtec’s products, along with the engineering capabilities of Samtec’s Teraspeed Consulting Group, Active System Group, and the Signal Integrity Group. Real World 28 Gbps The 28 Gbps Product … [Read more...]
SEARAY High Speed, High Density Connector
SEARAY™ is a family of high speed, high density connectors. SEARAY gives designers tons of design flexibility, much more than any other array product in the connector industry. Design Flexibility SEARAY is on a 1.27 mm X 1.27 mm grid. This is an open pin field grid array, which means we don’t have pins dedicated as signal or ground. Designers can specify some pins for single-ended signals, some can be routed as differential pairs, some ground, and some for power, all on the same … [Read more...]
GCT For Miniature Substrate Packaging
In this short video, Steve Groothuis, Chief Technology Officer for Samtec Microelectronics, explains Glass Core Technology (GCT), why it matters in advanced substrate packaging, and the solutions it provides. GCT is a proprietary process that leverages the performance benefits of glass by creating small diameter, fine pitch Through-Glass Vias that are metalized and hermetically sealed. The TGVs are linked via a unique thin film Redistribution Layer (RDL) process to create custom … [Read more...]
High Speed Mezzanine Connectors With Integral Ground Planes
Samtec Q Strip® connectors are designed for high speed board-to-board applications where signal integrity is essential. The Q Strip connectors have surface mount signal contacts as well as a surface mount ground plane between the two rows of signals for improved electrical performance. Q Strip products are available on three different pitches: 0.50 mm pitch (QTH, QSH Series)0.80 mm pitch (QTE, QSE Series)0.635 mm pitch (QTS, QSS Series) By the way, the 0.50 mm pitch versions are … [Read more...]
Microelectronics In Biomedical
Steve "Groot" Groothuis, CTO of Samtec Microelectronics, recently presented "Biomedical Solutions: Successfully Integrating New Chips, Packages, and Modules" at BIOMEDevice in Boston. The presentation included an overview of: How Samtec microelectronics are incorporated into medical devices and diagnostic equipmentGlass Core Technology (GCT), a proprietary process that leverages the performance benefits of glass by creating small diameter, fine pitch Through-Glass Vias (TGVs) that are … [Read more...]
12G SDI Signal Processing and Transmission Demonstration (NAB 2017)
Chris Shelly, Samtec's RF/SI Modeling Engineer, walks us through another 12G SDI product demonstration from NAB 2017. This demonstration showcases the Samtec BNC Edge Mount connector used in the Fidus® Gearbox+™ and the Phabrix® QX UHDTV 12G SDI generator/analyzer. This demonstration not only showcases the signal processing capabilities of both of these products, it also highlights the transmission of those signals through several other Samtec 75 ohm PCB connectors. Chris walks us … [Read more...]
- « Previous Page
- 1
- …
- 15
- 16
- 17
- 18
- 19
- 20
- Next Page »