Designing and evaluating interconnects requires broadband material characterization to determine dielectric properties. Traditional techniques used to characterize the complex permittivity and permeability of dielectrics, such as NRW and NIST, have some important limitations, such as the occurrence of air gaps and resonances in the results, which become even more challenging for broadband applications. In work…
DesignCon 2026 once again showcased systems, equipment, and components capable of powering the next-generation bandwidth required for artificial intelligence, co-packaged optics, hyperscale data centers, routers, switches, and high-performance computing (HPC), among other applications. And once again, Samtec was front and center with a variety of live product demonstrations of 448, 224, and 112 Gbps PAM4….
DesignCon 2026 placed strong emphasis on the influence that evolving AI infrastructure has on hardware design. The event underscored a transition from component-centric design to AI-driven system-level optimization for data centers, high-speed interconnects, test and measurement, and packaging. To that end, both Samtec and Keysight presented new products and technologies to address the next-generation bandwidth…
At DesignCon 2026, there was a lot of talk about 448 Gbps and how next-gen systems will achieve this data rate. One of the first steps in developing these new systems is to provide test and measurement data to designers. Samtec developed a prototype cable system representing a chip-to-chip, intra-tray GPU-to-GPU interconnect at 448 Gbps….
Designing Interconnects at the Edge of Performance For decades, improvements in computing performance have followed a familiar path. Faster processors, denser packaging, and higher data rates have driven steady advances across data centers, high-performance computing, and supercomputing platforms. Today, quantum computing represents the most extreme point on that curve. Although quantum computing is fundamentally different…
This live product demonstration, at SC25, features the Samtec Halo® near package optics system. It’s ideal for next-generation HPC Applications. Halo is a mid-board optical transceiver, designed for next-generation embedded applications that require either 112 or 56 Gbps PAM4 performance. Looking at the demo, an EXFO BERT generates a 112 Gbps PAM4 signal, which routes…
A live product demonstration from SC25 showcases Samtec’s Si-Fly HD co-packaged copper, or CPC, which boasts the industry’s highest footprint density, enabling 102.4T. That’s 512 lanes at 200G in a 95 x 95 mm chip substrate. It’s designed for a wide range of data center, high-performance computing, artificial intelligence, hyperscale, and machine learning applications. This is presented…
Artificial Intelligence is advancing quickly, driving the development of a wide range of new hardware accelerators for Scale-up, Scale-out, High-Performance Computing, and more. Samtec collaborates closely with customers and partners to develop innovative interconnect solutions tailored to real-world AI acceleration topologies. The OCP Open Accelerator Infrastructure, or OCP OAI, is one example. Samtec has several solutions…
Samtec’s ADM6 and ADF6, AcceleRate® HD array connectors—known for their slim profile and high-density 0.635 mm pitch—are now available with expanded stack height options ranging from 5 mm to 16 mm and pin counts from 40 to 400 positions. The product offering expansion allows design flexibility with quick delivery, supporting applications such as datacom, high-performance…
We’re looking forward to SC25. SC25 is the international event for high-performance computing, networking, storage, and analysis. Samtec will present its full line of high-performance connectors for HPCs, including 224 Gbps PAM4 solutions, 112 Gbps mid-board optical transceivers, and PCIe 7.0 interconnect systems, among others. Here’s a quick recap of what you’ll see at the Samtec…
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