200G Co-Packaged Channel With Broadcom SERDES and Samtec Si-Fly HD CPC
A live product demonstration from SC25 showcases Samtec’s Si-Fly HD co-packaged copper, or CPC, which boasts the industry’s highest footprint density, enabling 102.4T. That’s 512 lanes at 200G in a 95 x 95 mm chip substrate. It’s designed for a wide range of data center, high-performance computing, artificial intelligence, hyperscale, and machine learning applications.
This is presented in conjunction with our friends at Broadcom. This evaluation platform incorporates Broadcom’s industry-leading 224 Gbps SERDES technology and Samtec’s Si-Fly high-density co-packaged copper cable systems.
Looking at the demo, the signal path is a typical data center application type.
The 224 signal routes through 30 mm on the Broadcom substrate. From the Samtec CPC connector, through 10” of Samtec Hyper Low Skew Twinax cable, to a Samtec FOSFP-2 front panel connector, through a 1.5-meter passive DAC cable.
It loops back through another 10” of Samtec Eye Speed cable, to the CPC connector, and finally back to the 200G SERDES for analysis.
We see a BER of e-10, e-11, with a total channel loss of 42 dB. Again, that’s two meters of copper cable, and going through four connector systems.
As data rates climb to 200G and beyond, minimizing signal loss and preserving signal integrity become increasingly challenging to manage.
For more information, visit samtec.com/si-fly-hd, or contact us at [email protected].
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