IMAPS - International Microelectronics Assembly and Packaging Society - in one of the biggest events of the year in the IC Package and Assembly industry. Last week at IMAPS 2016, Samtec Microelectronics highlighted our world-class complex package and assembly capabilities and our emerging Glass Core Technology (GCT). Samtec's IC package and assembly capabilities include precision die attach, ultra-fine pitch wire bonding, expertise in packaging and substrate design, stacked … [Read more...]