Solder reflow plays an important role in the success and performance of high-bandwidth RF connectors. Sometimes, when a high-bandwidth RF connector is soldered together with an optimized PCB launch, the results can be unpredictable. It is important to investigate the root causes of solder reflow variation and analyze what techniques can deliver consistent performance across frequencies. In a new white paper from Samtec, “Impacts of Solder Reflow on High Bandwidth RF Connectors,” authors … [Read more...]
Practical Guidelines To Achieve Quality Connector Solder Joints: Part Two
This is the second in a series of three blog interviews with David Decker, the Manager of Samtec's Interconnect Processing Group (IPG). In these blogs, David answers some of the most frequently asked questions about achieving quality connector solder joints, as well as other connector-processing related issues. BTW, here's the link to the first blog. Our goal is to provide short answers that address the main issue of the question. If you want more information about a particular subject … [Read more...]
More Connector Plating FAQs: Underplating, Base Metals, Lubrication, Voltage
Once upon a time, in a blog a long, long time ago, in a galaxy far, far away, a wise connector guru said "Plating affects the life and quality of the connector system, including corrosion resistance, conductivity, solderability, and of course, cost." Actually, it wasn't that long ago; it was in a blog we posted last month. And it was written in Indiana, which does seem to be far away from everywhere. Finally, it wasn't a wise connector guru. Rather, it was written by me, although I was quoting … [Read more...]
Free Wideband RF Launches White Paper
Samtec recently published a major white paper, “Wideband RF Launches: Much More Than Footprints On PCBs.” This white paper shows that very wide bandwidth RF launches are possible to implement in PCBs, even with vias included. This does not mean it is a trivial task. Competing requirements, be they electrical, mechanical, manufacturing, or cost, must be considered and balanced simultaneously. This white paper -- a link to it is at the end of this blog -- elaborates on some of … [Read more...]
Practical Guidelines To Achieve Quality Connector Solder Joints: Part One
Many factors affect the quality and performance of a connector: pin material, the quality of the stamping, the quality of and choice of surface finish, and the tolerances on the plastic insulator, just to name a few. Beyond the connector, another factor that is crucial to the performance of the connector on the printed circuit board is the quality of the solder joints. This is the first in a series of three blogs, which are interviews with David Decker, the Manager of Samtec … [Read more...]
Connector Plating FAQs: Normal Force, Cycles, Temperature, and Other Essentials
Plating affects the life and quality of the connector system, including corrosion resistance, conductivity, solderability, and of course, cost. This is part two of a discussion with Phil Eckert, Samtec’s Quality Engineering Manager, and Matt Brown, Principal Engineer, about all things pertaining to connector plating. Here’s a link to part one. These blogs, and the upcoming ones in this series, answer connector plating questions that Samtec Quality and Processing experts are frequently asked. … [Read more...]
Via Stubs: Practical Strategies To Mitigate Return Loss
(This is the second in a series of blogs, from Sandeep Sankararaman, Samtec’s Principal RF and Signal Integrity Engineer, discussing design strategies for high-bandwidth RF launches. The first is entitled "What Is An RF Connector Launch?" The third is "Maximizing RF Launch Performance: The Impact of GND Vias." coming next week, discusses GND rings.) When using a through via to transition to an internal layer, there is a stub created by the part of the via that extends below the transition … [Read more...]
Wideband RF Launches: Literally, Everything You Need To Know
As the demand for higher frequencies and wider bandwidths continue their relentless march upward, RF connectors need to keep up and even exceed this demand. Mating the RF connector to a PCB or substrate requires careful consideration of several factors to get the full performance out of the connector. Let’s frame this concept by starting with a simple analogy: Putting tractor tires on a race car is not a recipe for success. Tires on a race car need to convert power from the engine … [Read more...]
A Performance Comparison of Air-Cooled vs. Immersion Cooled Connector Systems
As computing power continues to increase, air cooled systems cannot meet current thermal requirements for HPC hardware systems. Power consumption, space and performance must all be considered during system design. Immersion cooling is a fast-growing solution to economically combat system heat, noise, power consumption and compute density. Samtec’s Brian Niehoff presented “Thermal Management of HPC Hardware Architecture via Immersion Cooling” at the Exhibitor Forum at SC20. Brian’s … [Read more...]
Solder Processing with Success
Processing a component onto a PCB used to be fairly straightforward. Through-hole products, or a single or double row surface mount with a larger centerline rarely offer unique challenges obtaining a proper solder joint. However, as electronics continue to get smaller and connectors become more dense, there is a need to ensure that the inner rows of the connectors properly solder and obtain a strong solder joint. Connector manufacturers have addressed this in many ways, and one of the ways … [Read more...]