Mixed signal applications—where sensing, processing and power delivery coexist—have become common due to the rapid growth of wireless communication and sensors in complex electronics systems. Whether in aerospace, automotive, or high-performance computing, designers face the challenge of maintaining signal integrity, minimizing noise, and optimizing layout across differing types of signal communication. Due to the high…
Software defined radio (SDR) requirements are starting to exceed the performance capabilities of many traditional RF components. This challenge invites RF system architects to select connectors that were originally designed to meet the demanding signal integrity specifications of high-speed digital applications. This blog highlights some key details from a recent case study. The study explains…
What Are Industry Standards? Standards are all about compatibility and interoperability. End customers, especially government agencies and their primes, want standardization versus customization to bring down cost of items, improve availability and shorten lead times. Think of them as blueprints to a house, where the contractor can ensure the foundation, wiring and plumbing are well defined and…
Samtec, Inc. and Molex announced a license agreement naming Molex as a second source for the Samtec Si-Fly® HD 224 Gbps PAM4 product family. Here is a link to Samtec’s press release: “Samtec Inks Second-Source License Agreement with Molex to Expand Reach of Si-Fly HD High-Speed Interconnects for Data Center and AI Applications.” The Samtec…
Optimizing cable performance in high-data-rate (HDR) and high-speed applications is growing in importance. The good news is that it is possible to easily avoid common cable issues that negatively impact performance. For optimal installation, the appropriate length cables should be routed in an organized fashion, and cables should be bent and twisted properly. While it…
Samtec is excited to introduce you to the newest members of its AcceleRate HP® high-performance array family: 800-position APM6, APF6 at a 5 mm stack height. The AcceleRate HP® connector set delivers exceptional signal integrity performance and density (112 Gbps PAM4, 0.635 mm pitch). It’s an ideal solution for any system requiring extremely high data…
This is the final installment in a series of blogs about Samtec glass core technology as showcased at IMS 2025. Samtec’s proprietary glass core technology, or GCT, enables high-performance connectivity. Current applications include filters, antennas, splitters, and phased-array modules from leading companies in the communications and medical electronics sectors. Our most popular glass core technology…
Samtec glass core technology, or GCT, offers many benefits when compared to silicon or organic substrates, particularly at mm-wave frequencies and beyond. This includes an exceptional loss tangent, embedded passive components, less variation between components, and other advanced packaging capabilities. Instead of me telling you the benefits of glass, please check out this video from Nokia…
Yes. Contact wipe is a crucial element to examine during the interconnect design and development process. Qualification testing and understanding that sufficient wipe is achieved within a mated connector set provides confidence that interface surfaces will be cleaned of build-up and contamination in end applications. Interconnect companies, like Samtec, consider contact wipe during product development…
In this brief video from IMS 2025, Nokia Bell Labs’ Shahriar Shahramian discusses the benefits of glass substrates in their applications. Here’s a (almost verbatim) summary of Shahriar’s comments on the benefits of glass core technology: Glass is a phenomenal material. You are allowed to do things on glass that you traditionally cannot do on PCB…
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