Samtec and FCI announced the signing of a second-source agreement for Samtec to manufacture, market and sell FCI’s ExaMAX® high speed backplane system. We will keep you posted as more details become available. View The Full Press Release PDF Click here for a product overview: http://samtec.com/examax
Julian Ferry, Samtec’s High Speed R&D Manager, recently spoke to Connector Supplier about the latest developments in high speed interconnects, the applications driving them, and how Samtec is meeting the challenges. Here is a full copy of the interview, courtesy of Connector Supplier. Q&A: Samtec on Signal Integrity. By Patricia Staino, June 16, 2014 Recently…
Samtec’s ultra high density open pin field arrays, created on an 0,80 mm pitch can save you up to 50% board space compared to standard 1,27 mm pitch grid arrays. High density socket arrays, our SEAF8 Series, and terminal arrays, our SEAM8 Series, come standard with patented rugged Edge Rate™ contacts, which are less prone…
Samtec’s FireFly™ Micro Flyover System is an inside-the-box interconnect system that gives designers the option to future-proof their systems. This future proofing allows an easy upgrade from copper to optical with the same connector and footprint. With the highest 14 Gbps bandwidth density available, the FireFly™ system enables chip-to-chip, board-to-board and system-to-system connectivity at data…
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