Samtec’s ultra high density open pin field arrays, created on an 0,80 mm pitch can save you up to 50% board space compared to standard 1,27 mm pitch grid arrays.
High density socket arrays, our SEAF8 Series, and terminal arrays, our SEAM8 Series, come standard with patented rugged Edge Rate™ contacts, which are less prone to damage when “zippered” to unmate.
SEARAY™ .8 is currently available up to 300 I/Os
Two new options include an 8 row and a 10 row design which allow up to 500 I/Os. These are scheduled for release in Q3 2014.
SEARAY™ can be mapped as a single-ended or differential pair application, or a combination of both. Standard board stacking heights are 7 mm and 10 mm.
SEARAY™ .8 utilizes solder charge technology to simplify IR reflow termination and improve solder joint reliability. The advantage of this technology, compared to standard BGS/solder ball attachment, is the interconnects are subject to extreme heat only once during assembly of the connector to the PCS as opposed to twice with solder ball attach methods.
This becomes more relevant with the higher temperatures required for lead-free processing.
To learn more about SEARAY™ .8 go to http://www.samtec.com/connectors/high-speed-board-to-board/high-density-arrays/ultra-low-profile.aspx
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