Samtec has a long history of developing mezzanine interconnect solutions that meet and exceed our customer’s expectations. Our legacy revolves around standard board-to-board connectors used in applications ranging from TV remotes to MRI machines.
Our depth of solutions has grown as time has passed, but one family of products offers the density, performance and flexibility to support many high-speed board-to-board applications.
SEARAY™ High-Density Open Pin Field Array‘s many features and options resonate with engineers in many industries.
The open pin field design used on SEARAY™ provides engineers maximum routing and grounding flexibility. Designers can simultaneously run differential pairs, single-ended signals and power through the same 28+ Gbps interconnect.
SEARAY™ also utilizes Samtec’s Rugged Edge Rate® contact system. This enables a “zippered” mating motion which is less prone to damage when compared to other solutions.
Samtec’s SEARAY™ products are also the industry’s largest offering of high-speed, high-density open pin field arrays. Some examples include:
- SEAM-RA/ SEAF-RA Right Angle SEARAY™ targeted at micro-backplane and coplanar applications
- SEAMI 85Ω tuned SEARAY™ for industry standard 85Ω interface
- SEAM8/SEAF8 0.8mm pitch SEARAY™ provides 50% board space savings versus 1.27mm SEAM/SEAF
Samtec continues to expand our core SEARAY™ SEAM/SEAF series as well. Our latest product extension is now available with 15 positions in a 4-row configuration. This new expansion configuration is tooled for a 7mm stack height with more to come.
For more information on the SEARAY™ family of products, please see the following links:
