Samtec Features Latest Interconnect Options for HPC Applications at SC21

The global high-performance computing (HPC) ecosystem comes together each year at SuperComputing. SC21 offers data analysts and scientists, system architects, and design engineers the opportunity to learn, network and explore the latest in HPC solutions.

In 2020, the vent was fully virtual due to the global coronavirus pandemic. This year, the event will be hybrid. There will be an active online component. Additionally, representatives from industry, academia and governmental agencies will meet at America’s Center between November 14-19, 2021

As a global high-performance interconnect solutions provider, Samtec in a long-time sponsor of SuperComputing. This year, Samtec will feature the latest interconnect solutions, real-world high-performance product demonstrations, exhibitor forums and online presentations.

Exhibitor Forum

Thermal management and thermal mitigation are always of concern in HPC system architectures. How do the latest thermal relief techniques affect data rate performance at the interconnect level?

In this Exhibitor Forum, John Riley, Sr. Technical Marketing Engineer at Samtec, will present Optimized Component Thermal Management and Mitigation Techniques in HPC Applications.

Click here for more details.

Real-World High-Speed Product Demonstrations

Event attendees can stop by Samtec booth (#3007) to learn more about the following demos.

PCIe 4.0 Over Fiber Featuring Hot-Add Capabilities

Samtec and Dolphin Interconnect Solutions partner to showcase the latest in PCIe 4.0 over fiber applications. Their latest solutions feature hot-add capabilities that increase reliability on reduce downtime in HPC applications.

Immersion-cooled 28 Gbps Optical Transceiver

Samtec and Xilinx will highlight the 28 Gbps performance of Samtec’s FireFly^™ Micro Flyover System™ in immersion cooled, HPC applications. Samtec’s FireFly optical engine offers 28 Gbps per channel performance in a number of popular immersion cooling solutions.

Real World PCIe 6.0 and 112 GbE Interoperability for HPC Applications

Samtec and Synopsys showcase interoperability of PCIe 6.0 and 112 GbE solutions from IP to interconnect. Synopsys PCIe 6.0 IP supports multiple channels running over the Samtec PECFF Emulation Platform. Synopsys 112 GbE IP sources data that routes through leading mezzanine solutions from Samtec.

High-Density 112 Gbps Front Panel Solutions

Samtec and AlphaWave IP combine the latest 112 Gbps transceiver technology with next-gen front panel interconnect solutions. Samtec’s NovaRay^® I/O offers the industry’s highest density pluggable copper solutions ideally suited for HPC applications.

Samtec Virtual Booth in SC21 HUBB

For online attendees, Samtec virtual booth in the SC21 HUBB is chock full of technical goodies. Check out videos of the latest 112 Gbps PAM4 product demonstrations featuring the latest high-speed silicon from our partners.

Product catalogs and application guides for the latest 112 Gbps PAM4 interconnect solutions are available on demand.

Samtec technical experts will also present the following virtual courses on interest to the SC21 community:

• Wednesday, Nov. 17 – Matt Burns, Technical Marketing Manager
  • High-Bandwidth Low-Latency Interconnect for HPC System Architectures
• Thursday, Nov. 18 John Riley, Sr. Technical Marketing Engineer
  • Optimized Component Thermal Management and Mitigation Techniques in HPC Applications.

For more information, please e-mail Samtec’s technical experts at [email protected] or visit www.samtec.com.