Specifying interconnects is not always easy. With that in mind, the engineers at Samtec continue to create a wealth of technical information in the form of white papers, case studies, application notes, technical notes, published papers in journals and conference proceedings, webinars, and data sheets. These technical resources help with interconnect design.
All of these have been compiled in an updated Technical Library on Samtec.com. You can freely browse, download, and watch these resources at any time. (Samtec’s video assets are collected on our YouTube channel.)
White Papers

Samtec white papers are detailed studies that explain technical details critical for successful interconnect design. Here are some of the most recent white paper additions:
White Paper: Channel Performance Metric: A Definition of Interconnect Signal Integrity Performance
White Paper: Why Use Flyover Cable Systems?
Case Studies
Samtec case studies offer insight into a particular design experience. Part of Samtec’s Sudden Service® commitment is to provide assistance to customers who are implementing Samtec products, with an aim to help ensure a successful design. Here is a recent case study: Building the Oxide Rack
Published Papers

Engineers from Samtec also participate in technical conferences around the world, such as DesignCon, Supercomputing, OFC, and Electronica. Some of these papers are available in the Published Papers section of the technical library, as well as those that have appeared in trade journals. One recent published paper is:
Wideband RF Launches: More than Footprints on a PCB
We try to surface new additions to the technical library on social media and in this blog. But please feel free to stop by the technical library from time to time to see what’s new!
Also See:
Validating the Performance of Miniature Array Connectors – The Samtec Blog
How Does Solder Reflow Affect RF Connectors? – The Samtec Blog
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