Selecting a backplane design requires tradeoffs specific to a particular network topology and application. In some cases, the assessment of PCB vs cable backplane is not an “either/or” but a combination approach. This blog post, based on a conversation with Samtec’s Andrew Josephson, Brandon Gore, and Jonathan Sprigler, aims to answer some of the most common questions that come up when deciding should I use a PCB or cable backplane for a high-speed design? How do the two approaches compare on … [Read more...]
How Does Solder Reflow Affect RF Connectors?
Solder reflow plays an important role in the success and performance of high-bandwidth RF connectors. Sometimes, when a high-bandwidth RF connector is soldered together with an optimized PCB launch, the results can be unpredictable. It is important to investigate the root causes of solder reflow variation and analyze what techniques can deliver consistent performance across frequencies. In a new white paper from Samtec, “Impacts of Solder Reflow on High Bandwidth RF Connectors,” authors … [Read more...]
Characterizing High-Speed Digital Interfaces: Reflecting on Reflections
Today’s high-speed digital interfaces have become more sensitive to signal reflections. The result is a need to characterize and suppress channel and component discontinuities. How do you select a characterization method between those called out in standards such as PCIe, IEEE 802.3, and USB? In a DesignCon 2022 paper, Steve Krooswyk, Hansel Dsilva, Richard Mellitz, Stephen Hall, Adam Gregory, Beomtaek Lee, and John Riley aim to explain each reflection standard in regard to its history, use … [Read more...]