If you’re reading this, chances are you work with board level interconnects and are familiar with design and processing issues that affect them. If your job doesn’t require you to work with connectors, but you’re still reading this, then you are probably messed up and need some type of professional help. Assuming you’re in the…
Samtec and Teraspeed Consulting presented several papers at DesignCon 2015. The first is “Optimizing Symmetry In Open Pin Field Designs.” This paper presents a process for analyzing open field array structures. Various modes of propagation and coupling within the array of conductors are studied. We find that, counter intuitively, the use of additional ground structures…
Teraspeed Consulting and Samtec presented several papers at DesignCon 2015. Here’s a link to “Anisotropic Design Considerations For 28 Gbps Via to Stripline Transitions.” For 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation. Without accurate dielectric material models, it is impossible to close the loop between…
Samtec’s paper “Causality De-Mystified” has been selected as a finalist for a Best Paper Award at DesignCon 2015. The papers are ranked in terms of Quality, Relevance, Impact, Originality and Commercial Content with the aggregate score determining the ranking. Papers with the highest ranking are selected for a Best Paper Award with the live presentation…
Julian Ferry, Samtec’s High Speed R&D Manager, recently spoke to Connector Supplier about the latest developments in high speed interconnects, the applications driving them, and how Samtec is meeting the challenges. Here is a full copy of the interview, courtesy of Connector Supplier. Q&A: Samtec on Signal Integrity. By Patricia Staino, June 16, 2014 Recently…
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