The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). The 2018 ECTC will be held at The Sheraton San Diego Hotel & Marina, San Diego, California, USA, during May 29 – June 1, 2018, featuring about 40 … [Read more...]
International Microelectronics And Packaging Society (IMAPS) Device Packaging 2018
The 14th Annual Device Packaging Conference (DPC 2017) will be held in Fountain Hills, Arizona, on March 5-8, 2018. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It … [Read more...]
Advanced Packaging for Medical Microelectronics 2018
The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 23-24, 2018. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. The workshop will provide a venue for presentations and discussions focused on … [Read more...]
Samtec Microelectronics at ECTC 2017
Samtec will be attending ECTC 2017 from May 30 to June 2 at Booth 313/315. We will be featuring several IC packaging solutions such as flip chip, ultra high density micro interposers, as well as offering full system support. In addition, we will also be showcasing our glass core technology (GCT). ECTC The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic … [Read more...]
International Microelectronics And Packaging Society (IMAPS) 2017
Microelectronics packaging, whether in organic or glass substrates, is a hot topic floating around the electronics industry. At this years iMAPS convention, packaging will play a crucial role in product and design as guest speakers, students, and innovators come together to understand and implement future developments. This proprietary process combines the performance benefits of glass with small diameter, fine pitch Through-Glass Vias (TGVs) and unique thin-film Redistribution Layers (RDL) … [Read more...]