THE SAMTEC BLOG
Microelectronics packaging, whether in organic or glass substrates, is a hot topic floating around the electronics industry. At this years iMAPS convention, packaging will play a crucial role in product and design as guest speakers, students, and innovators come together to understand and implement future developments.
This proprietary process combines the performance benefits of glass with small diameter, fine pitch Through-Glass Vias (TGVs) and unique thin-film Redistribution Layers (RDL) for use in next-generation IC packaging. This revolutionary process enables performance optimized, ultra-miniaturized IC packages and modules.
Topics and features to be considered include:
Samtec will be attending iMaps and featuring our Microelectronics packaging and IC solutions from October 9 to October 12. For additional information and registration, please visit their official website.