May 29, 2018
June 1, 2018
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). The 2018 ECTC will be held at The Sheraton San Diego Hotel & Marina, San Diego, California, USA, during May 29 – June 1, 2018, featuring about 40 technical sessions (oral presentations, interactive presentations, and student posters), 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for exhibitors.
The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.
Samtec will be attending ECTC 2018 from May 29 to June 1 and be featuring our Microelectronics Packaging
solutions. For more information, please visit the show’s official website