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Advanced Packaging for Medical Microelectronics 2018

January 23, 2018 @ 7:00 am - January 24, 2018 @ 6:00 pm

The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 23-24, 2018. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. The workshop will provide a venue for presentations and discussions focused on traditional and emerging packaging technologies for wearable, portable and implantable devices, medical instrumentation, and life sciences consumables. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage new products, discussions and collaborations. This two-day event will draw invited experts in the medicine, sensing, microelectronics, and semiconductor packaging.

Steven Groothuis, Chief Technology Officer at Samtec Microelectronics, will be presenting the following abstract:

The Needs and Challenges Facing All Aspects of Medical Applications and Packaging:

When faced with medical device and component needs and challenges, most packaging engineers thrive in defining innovations, workarounds and solutions addressing those needs and challenges. However, advanced biomedical devices require extensive interdisciplinary development efforts from technologists and medical professionals as well as extensive testing and certification. Various new, exciting, and novel applications of MEMS & sensor technologies are central to the medical industry, from improving & innovating large medical equipment and portable medical instrumentation to enabling medical wearables and point of care devices.

Areas of medical device packaging technology development and pathfinding need to include: heterogeneous device technologies, biocompatible materials, elimination of cytotoxicity, miniaturization schemes, robust interconnects (at device, package, module, & system levels), and the incorporation of microfluidics and optics. This presentation will focus on specific needs and challenges within upcoming medical applications and medical device packaging.

Details

Start:
January 23, 2018 @ 7:00 am
End:
January 24, 2018 @ 6:00 pm
Event Category:
Event Tags:
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Website:
http://www.imaps.org/medical/

Organizer

iMAPS
Phone:
(919) 293-5000
Website:
http://www.imaps.org/