Microelectronics packaging, whether in organic or glass substrates, is a hot topic floating around the electronics industry. At this years iMAPS convention, packaging will play a crucial role in product and design as guest speakers, students, and innovators come together to understand and implement future developments. This proprietary process combines the performance benefits of glass with small diameter, fine pitch Through-Glass Vias (TGVs) and unique thin-film Redistribution Layers (RDL) … [Read more...]
Samtec Expert to Present at SEMICON West
Steve Groothuis, CTO of Samtec Microelectronics, in one of many panelists presenting at the Advanced Packaging Forum during SEMICON West next week at the Moscone Center in San Francisco, CA. The Advanced Packaging Forum gathers executives, university researchers, engineers, R+D personnel, program managers and other technology experts across the IC packaging and assembly industry. Attendees you will learn about some of the latest assembly and packaging technologies—wafer-level … [Read more...]