Steve Groothuis, CTO of Samtec Microelectronics, in one of many panelists presenting at the Advanced Packaging Forum during SEMICON West next week at the Moscone Center in San Francisco, CA. The Advanced Packaging Forum gathers executives, university researchers, engineers, R+D personnel, program managers and other technology experts across the IC packaging and assembly industry. Attendees you will learn about some of the latest assembly and packaging technologies—wafer-level … [Read more...]